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ADS8401IPFBTG4

Texas Instruments

ADS8401IPFBTG4 by Texas Instruments

Texas Instruments ADS8401IPFBTG4 is a 16-bit ADC with 0.0092% EL, 1.25 MHz sample rate, and 5V nominal voltage. Ideal for industrial applications requiring high precision analog-to-digital conversion in a compact square package with thin profile and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,498 parts In-Stock

1+ parts

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6,498

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Digiode

USA . 559 parts In-Stock

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559

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 430 parts In-Stock

1+ parts

$1.150

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-

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430

$1.150

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Northwest PG Solutions

USA . 372 parts In-Stock

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$1.265

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372

$1.265

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Parana Technologies

USA . 1,535 parts In-Stock

1+ parts

$5.289

100+ parts

-

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$5.917

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1,535

$5.289

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$5.917

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DigiPath Technology Company

USA . 1,882 parts In-Stock

1+ parts

$5.824

100+ parts

$5.358

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1,882

$5.824

$5.358

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ChromeModa Solutions

Germany . 4,254 parts In-Stock

1+ parts

$5.943

100+ parts

$4.873

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4,254

$5.943

$4.873

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IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$5.943

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$5.349

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1,691

$5.943

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$5.349

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AZTECH Wire

Italy . 385 parts In-Stock

1+ parts

$18.341

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385

$18.341

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One Stop Electronics

USA . 729 parts In-Stock

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$31.000

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729

$31.000

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Corphita

USA . 2,901 parts In-Stock

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2,901

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Microchip USA

USA . 420 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the ADS8401IPFBTG4 Analog-to-Digital Converter by Texas Instruments. Crafted with superior quality and cutting-edge technology, this innovative device delivers exceptional performance in a compact package. Whether you're working on industrial automation, medical equipment, or telecommunications systems, this ADC offers unmatched accuracy and speed. Trust Texas Instruments to provide you with the tools you need to take your designs to the next level. Elevate your projects with the ADS8401IPFBTG4 and unleash the full potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, making it suitable for a variety of applications.

No. of Bits: 16

With 16 bits, this ADC provides high resolution and accuracy in converting analog signals to digital, ensuring precise data conversion.

Maximum Linearity Error (EL): 0.0092%

The low linearity error ensures that the converted digital output closely matches the input analog signal, providing accurate data conversion.

Maximum Conversion Time: 0.61 us

The fast conversion time of 0.61 microseconds allows for quick sampling and conversion of analog signals, making this ADC suitable for high-speed applications.

Sample Rate: 1.25 MHz

The high sample rate of 1.25 MHz enables fast and efficient sampling of analog signals, making this ADC ideal for applications requiring real-time data acquisition.

Terminal Form: GULL WING

The gull wing terminal form allows for easy and reliable soldering onto PCBs, ensuring secure connections and better overall performance of the product.

Technical Specifications

Analog-to-Digital Converters ADS8401IPFBTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0092 %

Sample Rate:

1.25 MHz

Hold Mode:

Sample

Maximum Conversion Time:

610 ns

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8401IPFBTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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