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ADS8401IPFBRG4

Texas Instruments

ADS8401IPFBRG4 by Texas Instruments

Texas Instruments' ADS8401IPFBRG4 is a 16-bit ADC with 0.0092% EL, 1.25 MHz sample rate, and 5V nominal voltage. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package with quad terminals and GULL WING form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,934 parts In-Stock

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4,934

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Vyrian

USA . 2,212 parts In-Stock

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2,212

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One Stop Electronics

USA . 911 parts In-Stock

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$6.000

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911

$6.000

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Parana Technologies

USA . 904 parts In-Stock

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$13.430

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-

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$13.949

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904

$13.430

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$13.949

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DigiPath Technology Company

USA . 1,175 parts In-Stock

1+ parts

$14.788

100+ parts

$13.605

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1,175

$14.788

$13.605

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ChromeModa Solutions

Germany . 4,572 parts In-Stock

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$15.090

100+ parts

$12.374

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4,572

$15.090

$12.374

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IDEA Electronic Components Group

UK . 225 parts In-Stock

1+ parts

$15.090

100+ parts

$14.336

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$13.581

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225

$15.090

$14.336

$13.581

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AZTECH Wire

Italy . 732 parts In-Stock

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$18.977

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732

$18.977

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Corphita

USA . 3,058 parts In-Stock

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Northwest PG Solutions

USA . 2,286 parts In-Stock

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Native Components

USA . 230 parts In-Stock

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Microchip USA

USA . 201 parts In-Stock

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Overview

Unlock the power of precise analog-to-digital conversion with the ADS8401IPFBRG4 by Texas Instruments. This high-quality ADC offers unparalleled accuracy and reliability, making it ideal for a wide range of applications in industries such as industrial automation, telecommunications, and medical devices. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product delivers exceptional performance and value. Upgrade your system today with the ADS8401IPFBRG4 and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

No. of Bits: 16

With 16 bits resolution, this ADC provides high accuracy and precision in converting analog signals to digital, suitable for demanding measurement or control systems.

Maximum Linearity Error (EL): 0.0092%

The low linearity error ensures that the output digital data closely matches the input analog signal, resulting in accurate and reliable conversion.

Power Supplies (V): 3/5,5

Support for multiple power supply voltages allows flexibility in designing and integrating this ADC into various systems with different power requirements.

Maximum Operating Temperature: 85 °C

The high operating temperature range enables the ADC to perform in harsh environmental conditions without compromising its functionality.

Sample Rate: 1.25 MHz

High sampling rate of 1.25 MHz allows the ADC to capture fast-changing analog signals accurately, making it suitable for applications requiring real-time data conversion.

Technical Specifications

Analog-to-Digital Converters ADS8401IPFBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0092 %

Sample Rate:

1.25 MHz

Hold Mode:

Sample

Maximum Conversion Time:

610 ns

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8401IPFBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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