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ADS8383IPFBTG4

Texas Instruments

ADS8383IPFBTG4 by Texas Instruments

Texas Instruments ADS8383IPFBTG4 is an 18-bit ADC with 0.0038% linearity error, 1.52us conversion time, and 0.5MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,856 parts In-Stock

1+ parts

-

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5,856

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Digiode

USA . 3,520 parts In-Stock

1+ parts

-

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3,520

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 957 parts In-Stock

1+ parts

$0.291

100+ parts

-

1k+ parts

-

10k+ parts

$0.279

957

$0.291

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-

$0.279

Northwest PG Solutions

USA . 670 parts In-Stock

1+ parts

$0.320

100+ parts

-

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$0.282

670

$0.320

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-

$0.282

Parana Technologies

USA . 1,688 parts In-Stock

1+ parts

$4.535

100+ parts

$421.102

1k+ parts

$4.081

10k+ parts

-

1,688

$4.535

$421.102

$4.081

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DigiPath Technology Company

USA . 592 parts In-Stock

1+ parts

$4.993

100+ parts

$4.594

1k+ parts

-

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592

$4.993

$4.594

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ChromeModa Solutions

Germany . 5,921 parts In-Stock

1+ parts

$5.095

100+ parts

$4.178

1k+ parts

-

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5,921

$5.095

$4.178

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IDEA Electronic Components Group

UK . 1,505 parts In-Stock

1+ parts

$5.095

100+ parts

-

1k+ parts

$4.586

10k+ parts

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1,505

$5.095

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$4.586

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AZTECH Wire

Italy . 203 parts In-Stock

1+ parts

$8.995

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203

$8.995

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One Stop Electronics

USA . 625 parts In-Stock

1+ parts

$35.000

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625

$35.000

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Corphita

USA . 679 parts In-Stock

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679

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Microchip USA

USA . 219 parts In-Stock

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Overview

Elevate your analog-to-digital conversion with the ADS8383IPFBTG4 by Texas Instruments. Crafted with precision and expertise, this converter delivers unrivaled quality and performance. Perfect for a wide range of applications, this product offers customers unmatched value and benefits. Experience seamless operation and reliability with the ADS8383IPFBTG4, designed to meet your needs and exceed expectations. Trust in Texas Instruments for cutting-edge technology that empowers innovation. Elevate your projects with the ADS8383IPFBTG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material ensures ease of handling and protection of internal components.

No. of Bits: 18

Provides high resolution and accuracy for data conversion.

Maximum Linearity Error (EL): 0.0038 %

Ensures precise and reliable conversion of analog signals to digital data.

Sample Rate: 0.5 MHz

High sample rate allows for fast and efficient conversion of input signals.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes the successive approximation method for accurate and efficient analog-to-digital conversion.

Maximum Analog Input Voltage: 4.2 V

Accepts a wide range of analog input voltages for versatile applications.

Nominal Supply Voltage: 5 V

Operates efficiently at a standard supply voltage for compatibility with common power sources.

Technical Specifications

Analog-to-Digital Converters ADS8383IPFBTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0038 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.52 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8383IPFBTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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