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ADS8383IPFBRG4

Texas Instruments

ADS8383IPFBRG4 by Texas Instruments

Texas Instruments ADS8383IPFBRG4 is an 18-bit ADC with 0.0038% EL, 1.52us conversion time, and 0.5MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact square package with thin profile and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,649 parts In-Stock

1+ parts

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3,649

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Digiode

USA . 3,388 parts In-Stock

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3,388

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Distributors (Availability)

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AZTECH Wire

Italy . 890 parts In-Stock

1+ parts

$8.096

100+ parts

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890

$8.096

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Parana Technologies

USA . 2,127 parts In-Stock

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$21.432

100+ parts

-

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$21.788

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2,127

$21.432

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$21.788

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One Stop Electronics

USA . 1,315 parts In-Stock

1+ parts

$22.000

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1,315

$22.000

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DigiPath Technology Company

USA . 733 parts In-Stock

1+ parts

$23.599

100+ parts

$21.711

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733

$23.599

$21.711

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ChromeModa Solutions

Germany . 6,363 parts In-Stock

1+ parts

$24.081

100+ parts

$19.746

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6,363

$24.081

$19.746

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IDEA Electronic Components Group

UK . 1,633 parts In-Stock

1+ parts

$24.081

100+ parts

$22.877

1k+ parts

$21.673

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1,633

$24.081

$22.877

$21.673

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Northwest PG Solutions

USA . 1,287 parts In-Stock

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1,287

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Native Components

USA . 859 parts In-Stock

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Corphita

USA . 676 parts In-Stock

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Kepictronics

USA . 450 parts In-Stock

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450

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Microchip USA

USA . 442 parts In-Stock

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442

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Overview

Unlock the power of precision with the Texas Instruments ADS8383IPFBRG4 Analog-to-Digital Converter. Crafted with expertise and quality by Texas Instruments, this device offers unparalleled accuracy and efficiency in converting analog signals to digital data. Ideal for a wide range of applications, this converter provides seamless integration and reliable performance. Experience the value and benefits of superior technology with the ADS8383IPFBRG4, delivering exceptional results and driving innovation in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the components inside, making the product reliable for long-term use.

No. of Bits: 18

Having 18 bits allows for high resolution and accuracy in converting analog signals to digital, making this product suitable for applications requiring precise measurements.

Maximum Linearity Error (EL): 0.0038 %

The low linearity error ensures that the converted digital output closely matches the input analog signal, resulting in accurate and reliable data conversion.

Power Supplies (V): 3/5,5

The ability to operate with multiple power supply voltages allows for flexibility in different system configurations and power requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for industrial applications.

Sample Rate: 0.5 MHz

The high sample rate of 0.5 MHz enables fast and efficient conversion of analog signals to digital, ensuring real-time data processing.

Technical Specifications

Analog-to-Digital Converters ADS8383IPFBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0038 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.52 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

ADS8383IPFBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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