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ADS8383IPFBR

Texas Instruments

ADS8383IPFBR by Texas Instruments

Texas Instruments ADS8383IPFBR is an 18-bit ADC with 0.0038% EL, 1.52us conversion time, and 0.5MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,672 parts In-Stock

1+ parts

-

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7,672

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Digiode

USA . 1,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,014

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 707 parts In-Stock

1+ parts

$0.092

100+ parts

-

1k+ parts

-

10k+ parts

$0.088

707

$0.092

-

-

$0.088

Northwest PG Solutions

USA . 255 parts In-Stock

1+ parts

$0.101

100+ parts

-

1k+ parts

-

10k+ parts

$0.089

255

$0.101

-

-

$0.089

One Stop Electronics

USA . 350 parts In-Stock

1+ parts

$11.000

100+ parts

-

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350

$11.000

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AZTECH Wire

Italy . 681 parts In-Stock

1+ parts

$13.916

100+ parts

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681

$13.916

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Parana Technologies

USA . 35 parts In-Stock

1+ parts

$15.255

100+ parts

-

1k+ parts

$15.653

10k+ parts

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35

$15.255

-

$15.653

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DigiPath Technology Company

USA . 1,312 parts In-Stock

1+ parts

$16.798

100+ parts

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1,312

$16.798

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ChromeModa Solutions

Germany . 2,333 parts In-Stock

1+ parts

$17.141

100+ parts

$14.056

1k+ parts

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2,333

$17.141

$14.056

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IDEA Electronic Components Group

UK . 1,481 parts In-Stock

1+ parts

$17.141

100+ parts

$16.284

1k+ parts

$15.427

10k+ parts

-

1,481

$17.141

$16.284

$15.427

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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3,790

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Corphita

USA . 753 parts In-Stock

1+ parts

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753

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Microchip USA

USA . 215 parts In-Stock

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215

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Overview

Elevate your analog-to-digital conversion experience with the ADS8383IPFBR by Texas Instruments. Crafted with precision and reliability, this converter offers unparalleled performance in a variety of applications. From industrial automation to medical equipment, this product delivers precise results with minimal error, ensuring optimal efficiency and accuracy. Say goodbye to compromise and hello to excellence with the ADS8383IPFBR - the ultimate solution for all your conversion needs. Unlock a world of possibilities and elevate your projects with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product.

No. of Bits: 18

High number of bits ensures high resolution and accuracy in conversion.

Maximum Linearity Error (EL): 0.0038%

Low linearity error ensures precise and consistent conversion results.

Power Supplies (V): 3/5,5

Support for multiple power supply voltages for flexibility in different applications.

Maximum Conversion Time: 1.52 us

Fast conversion time enables quick processing of analog signals.

Maximum Analog Input Voltage: 4.2 V

Support for higher analog input voltage range for compatibility with various signal levels.

Sample Rate: 0.5 MHz

High sample rate allows capturing of fast-changing analog signals with accuracy.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC provides accurate conversion with lower power consumption.

Technical Specifications

Analog-to-Digital Converters ADS8383IPFBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0038 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.52 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

ADS8383IPFBR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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