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ADS8382IRHPR

Texas Instruments

ADS8382IRHPR by Texas Instruments

Texas Instruments ADS8382IRHPR is an 18-bit ADC with 0.0019% EL, 1.16us conversion time, and 0.6MHz sample rate. Ideal for industrial applications, it operates b/w -40 to 85°C with a supply voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,329 parts In-Stock

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5,329

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Digiode

USA . 4,534 parts In-Stock

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4,534

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Distributors (Availability)

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Native Components

USA . 962 parts In-Stock

1+ parts

$0.125

100+ parts

-

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$0.120

962

$0.125

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$0.120

Northwest PG Solutions

USA . 930 parts In-Stock

1+ parts

$0.138

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-

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$0.121

930

$0.138

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$0.121

One Stop Electronics

USA . 1,624 parts In-Stock

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$7.000

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1,624

$7.000

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Parana Technologies

USA . 267 parts In-Stock

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$18.197

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$18.337

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267

$18.197

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$18.337

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AZTECH Wire

Italy . 334 parts In-Stock

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$19.259

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334

$19.259

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DigiPath Technology Company

USA . 2,037 parts In-Stock

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$20.037

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2,037

$20.037

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ChromeModa Solutions

Germany . 3,356 parts In-Stock

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$20.446

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$16.766

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3,356

$20.446

$16.766

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IDEA Electronic Components Group

UK . 1,587 parts In-Stock

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$20.446

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$19.424

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$18.401

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1,587

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$18.401

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QUARKTWIN TECHNOLOGY LTD

USA . 17,728 parts In-Stock

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Lixinc

USA . 15,055 parts In-Stock

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Corphita

USA . 4,731 parts In-Stock

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Microchip USA

USA . 3,784 parts In-Stock

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Authorized Procurement Solutions

USA . 1,650 parts In-Stock

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Overview

Unlock the power of precision and reliability with the ADS8382IRHPR Analog-to-Digital Converter by Texas Instruments. Crafted with superior quality and cutting-edge technology, this high-performance ADC is the perfect solution for a wide range of industrial applications. With its fast conversion time and low linearity error, this converter delivers accurate results every time. Trust Texas Instruments to provide you with a product that offers unmatched value, benefits, and advantages, making it a must-have for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for packaging electronic components as it provides good protection and insulation for the internal circuitry.

Surface Mount: YES

Allows for easy integration onto circuit boards, reducing the need for manual soldering and saving space.

No. of Bits: 18

Provides high resolution and accuracy in converting analog signals to digital values.

Maximum Linearity Error (EL): 0.0019%

Ensures precise and accurate conversion of analog signals with minimal error.

Power Supplies (V): 3/5,5

Supports a wide range of power supply voltages for flexibility in different applications.

No. of Terminals: 28

Offers multiple connection points for interfacing with external components and devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides options for different mounting and cooling configurations to suit various design requirements.

Maximum Operating Temperature: 85 °C

Allows for reliable operation in industrial environments with high temperatures.

Minimum Operating Temperature: -40 °C

Ensures the ADC can function in a wide range of temperature conditions.

Terminal Position: QUAD

Facilitates easy connection and placement on the circuit board.

Maximum Conversion Time: 1.16 us

Enables fast and efficient conversion of analog signals to digital data.

Maximum Seated Height: 1 mm

Allows for compact and low-profile designs when integrating the ADC into a system.

Width: 6 mm

Compact size makes it suitable for space-constrained applications.

Length: 6 mm

Compact size makes it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with varying temperatures.

Maximum Analog Input Voltage: 4.2 V

Supports a wide range of analog input voltages for versatile applications.

Sample Rate: 0.6 MHz

Provides high-speed sampling for capturing and converting analog signals effectively.

Terminal Form: NO LEAD

Simplifies the soldering process and improves reliability of connections.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Utilizes a reliable and efficient conversion method for accurate digital representation of analog signals.

Nominal Supply Voltage: 5 V

Standard voltage supply for compatibility with many electronic systems.

Output Bit Code: 2'S COMPLEMENT BINARY

Provides a common output format for easy interfacing with digital systems.

Terminal Pitch: 0.65 mm

Allows for precise and compact layout of terminals on the package.

Minimum Analog Input Voltage: -4.2 V

Supports bipolar input signals for more versatile applications.

Output Format: SERIAL

Enables efficient transfer of digital data to external devices in serial communication.

Sample and Hold/Track and Hold: SAMPLE

Utilizes sample and hold functionality for accurate conversion of input signals.

Technical Specifications

Analog-to-Digital Converters ADS8382IRHPR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0019 %

Sample Rate:

600 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.16 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

-4.2 V

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.236 in (6 mm)

Length:

0.236 in (6 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC28,.24SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N28

Qualified:

No

Trade Compliance

ADS8382IRHPR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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