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ADS8381IPFBR

Texas Instruments

ADS8381IPFBR by Texas Instruments

Texas Instruments ADS8381IPFBR is an 18-bit ADC with 0.0023% EL, 1.4us conversion time, and 0.58MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact 7x7mm flatpack package with GULL WING terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,559 parts In-Stock

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Digiode

USA . 1,841 parts In-Stock

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1,841

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Distributors (Availability)

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Native Components

USA . 173 parts In-Stock

1+ parts

$0.058

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-

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$0.056

173

$0.058

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$0.056

AZTECH Wire

Italy . 387 parts In-Stock

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$11.593

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387

$11.593

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Parana Technologies

USA . 97 parts In-Stock

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$24.723

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$25.393

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97

$24.723

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$25.393

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One Stop Electronics

USA . 620 parts In-Stock

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$25.000

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620

$25.000

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DigiPath Technology Company

USA . 824 parts In-Stock

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$27.223

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824

$27.223

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ChromeModa Solutions

Germany . 5,007 parts In-Stock

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$27.779

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$22.779

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$27.779

$22.779

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IDEA Electronic Components Group

UK . 1,651 parts In-Stock

1+ parts

$27.779

100+ parts

$26.390

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$25.001

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1,651

$27.779

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Corphita

USA . 1,876 parts In-Stock

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Northwest PG Solutions

USA . 1,233 parts In-Stock

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Microchip USA

USA . 484 parts In-Stock

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Kepictronics

USA . 43 parts In-Stock

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Overview

Unlock the power of precise data conversion with the ADS8381IPFBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that are essential for a wide range of applications. The ADS8381IPFBR offers unmatched accuracy and reliability, ensuring that your data is captured with maximum precision. Whether you're working in industrial automation, telecommunications, or medical imaging, this converter provides exceptional value and performance that will elevate your projects to new heights. Trust Texas Instruments for cutting-edge technology that delivers results you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the ADC, ensuring a longer lifespan.

No. of Bits: 18

High precision and accuracy in converting analog signals to digital, making it suitable for applications requiring fine resolution.

Maximum Linearity Error (EL): 0.0023%

Ensures high accuracy in conversion, leading to reliable and consistent digital output.

Power Supplies (V): 3/5,5

Supports multiple power supply options, providing flexibility in different system configurations.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without compromising performance.

Maximum Conversion Time: 1.4 us

Fast conversion time allows for real-time processing of analog signals, making it suitable for time-sensitive applications.

Technology: CMOS

Low power consumption and high noise immunity, contributing to energy efficiency and reliable operation.

Output Bit Code: BINARY

Standard output format for digital data, compatible with most digital systems and processors.

Sample and Hold/Track and Hold: SAMPLE

Utilizes a sample-and-hold circuit for accurate and stable analog signal conversion.

Technical Specifications

Analog-to-Digital Converters ADS8381IPFBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0023 %

Sample Rate:

580 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.4 µs

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.096 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

ADS8381IPFBR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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