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ADS8353IRTET

Texas Instruments

ADS8353IRTET by Texas Instruments

ADS8353IRTET by Texas Instruments is a 16-bit ADC with 0.0038% EL, operating at 0.6 MHz sample rate. Ideal for automotive applications, it has 2 analog in channels, operates at -40 to 125°C, and supports binary output format. With a compact chip carrier package style and low power consumption of 10mA, it's suitable for space-constrained designs.

Median Price

$25.980

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,010 parts In-Stock

1+ parts

$17.530

100+ parts

$15.312

1k+ parts

$10.560

10k+ parts

-

2,010

$17.530

$15.312

$10.560

-

DigiKey

USA . 238 parts In-Stock

1+ parts

$25.980

100+ parts

$18.246

1k+ parts

$17.182

10k+ parts

-

238

$25.980

$18.246

$17.182

-

Mouser Electronics

USA . 233 parts In-Stock

1+ parts

$25.980

100+ parts

$18.250

1k+ parts

$17.580

10k+ parts

-

233

$25.980

$18.250

$17.580

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$15.840

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$15.840

-

-

-

Digiode

USA . 4,975 parts In-Stock

1+ parts

$16.654

100+ parts

-

1k+ parts

-

10k+ parts

-

4,975

$16.654

-

-

-

Chip Stock

USA . 8,850 parts In-Stock

1+ parts

-

100+ parts

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8,850

-

-

-

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Vyrian

USA . 7,162 parts In-Stock

1+ parts

-

100+ parts

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7,162

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-

-

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VNN

France . 2,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,884

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,364 parts In-Stock

1+ parts

$6.562

100+ parts

-

1k+ parts

$7.303

10k+ parts

-

1,364

$6.562

-

$7.303

-

DigiPath Technology Company

USA . 58 parts In-Stock

1+ parts

$7.226

100+ parts

-

1k+ parts

-

10k+ parts

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58

$7.226

-

-

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ChromeModa Solutions

Germany . 6,051 parts In-Stock

1+ parts

$7.373

100+ parts

$6.046

1k+ parts

-

10k+ parts

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6,051

$7.373

$6.046

-

-

IDEA Electronic Components Group

UK . 54 parts In-Stock

1+ parts

$7.373

100+ parts

-

1k+ parts

$6.636

10k+ parts

-

54

$7.373

-

$6.636

-

Ampacity Inc.

Singapore . 580 parts In-Stock

1+ parts

$12.490

100+ parts

-

1k+ parts

-

10k+ parts

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580

$12.490

-

-

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Corphita

USA . 1,370 parts In-Stock

1+ parts

$15.777

100+ parts

-

1k+ parts

-

10k+ parts

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1,370

$15.777

-

-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$15.840

100+ parts

-

1k+ parts

$15.048

10k+ parts

$14.731

2,000

$15.840

-

$15.048

$14.731

Continental Prestige Electronics

USA . 1,696 parts In-Stock

1+ parts

$15.840

100+ parts

-

1k+ parts

-

10k+ parts

$15.523

1,696

$15.840

-

-

$15.523

Lixinc

USA . 11,011 parts In-Stock

1+ parts

-

100+ parts

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11,011

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-

-

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

1+ parts

-

100+ parts

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6,000

-

-

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Argo Parts USA

USA . 473 parts In-Stock

1+ parts

-

100+ parts

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473

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Overview

Unlock precision and efficiency with the Texas Instruments ADS8353IRTET Analog-to-Digital Converter. Crafted with expertise and innovation, this converter offers unparalleled accuracy with a maximum linearity error of 0.0038%. Ideal for automotive applications, this converter boasts a wide temperature range from -40°C to 125°C, ensuring reliability in any environment. Experience seamless integration with its surface mount design and compact square package shape. Elevate your designs with the ADS8353IRTET and witness the difference in performance and quality that Texas Instruments delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this ADC lightweight and durable, ideal for various applications.

No. of Analog In Channels: 2

With two analog input channels, this ADC allows for versatile and simultaneous measurements, enhancing efficiency.

Surface Mount: YES

Being surface mountable, this ADC is easy to integrate onto PCBs, saving space and simplifying assembly processes.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it suitable for designs with limited space constraints.

No. of Bits: 16

With 16 bits resolution, this ADC offers high precision and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0038%

The low linearity error ensures that the output digital data closely matches the input analog signal, maintaining accuracy.

Power Supplies (V): 3.3,5

The compatibility with multiple power supply voltages of 3.3V and 5V offers flexibility in different system requirements.

No. of Terminals: 16

The 16 terminals provide ample connectivity options, allowing for easy integration with external components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The different package styles offer versatility in mounting options, catering to various design preferences.

Technical Specifications

Analog-to-Digital Converters ADS8353IRTET attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0038 %

Sample Rate:

600 kHz

Hold Mode:

Sample

Maximum Conversion Time:

730 ns

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-1.2 V

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

10 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC16,.12SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8353IRTET Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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