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ADS8342IPFBTG4

Texas Instruments

ADS8342IPFBTG4 by Texas Instruments

The Texas Instruments ADS8342IPFBTG4 is a 16-bit ADC with 4 analog input channels, 0.0092% linearity error, and 0.25 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact square package with thin profile and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,476 parts In-Stock

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6,476

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Digiode

USA . 3,195 parts In-Stock

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3,195

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Chip Stock

USA . 235 parts In-Stock

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235

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Distributors (Availability)

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Native Components

USA . 58 parts In-Stock

1+ parts

$0.197

100+ parts

-

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-

10k+ parts

$0.189

58

$0.197

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-

$0.189

Northwest PG Solutions

USA . 2,311 parts In-Stock

1+ parts

$0.217

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-

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$0.191

2,311

$0.217

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$0.191

AZTECH Wire

Italy . 813 parts In-Stock

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$7.473

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813

$7.473

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Parana Technologies

USA . 1,413 parts In-Stock

1+ parts

$21.105

100+ parts

$1,959.962

1k+ parts

$18.995

10k+ parts

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1,413

$21.105

$1,959.962

$18.995

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One Stop Electronics

USA . 444 parts In-Stock

1+ parts

$22.000

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444

$22.000

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DigiPath Technology Company

USA . 117 parts In-Stock

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$23.240

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117

$23.240

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IDEA Electronic Components Group

UK . 2,105 parts In-Stock

1+ parts

$23.714

100+ parts

$22.528

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$21.343

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2,105

$23.714

$22.528

$21.343

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ChromeModa Solutions

Germany . 654 parts In-Stock

1+ parts

$23.714

100+ parts

$19.445

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654

$23.714

$19.445

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Corphita

USA . 909 parts In-Stock

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Microchip USA

USA . 178 parts In-Stock

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Overview

Enhance your analog-to-digital conversion experience with the ADS8342IPFBTG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this 16-bit ADC. Ideal for a wide range of applications, from industrial automation to medical equipment, this converter boasts impressive accuracy and quick conversion times. Trust in Texas Instruments to provide top-notch products that offer value, efficiency, and precision to meet all your needs. Elevate your designs with the ADS8342IPFBTG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product reliable for long-term use.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be converted simultaneously, increasing efficiency and flexibility in data acquisition.

No. of Bits: 16

With 16 bits resolution, this ADC can provide high accuracy and precision in converting analog signals to digital data.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can withstand harsh environmental conditions and can be used in industrial settings.

Technical Specifications

Analog-to-Digital Converters ADS8342IPFBTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0092 %

Sample Rate:

250 kHz

Hold Mode:

Sample

Maximum Conversion Time:

34 µs

Electrical Specifications

Power Supplies:

±5 V

Minimum Analog Input Voltage:

-2.5 V

Maximum Analog Input Voltage:

2.55 V

Nominal Supply Voltage:

5 V

Nominal Negative Supply Voltage:

-5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

16.8 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8342IPFBTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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