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ADS8342IBPFBR

Texas Instruments

ADS8342IBPFBR by Texas Instruments

The Texas Instruments ADS8342IBPFBR is a 16-bit ADC with 4 analog in channels, 0.0061% max linearity error, and 0.25 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion within a temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,326 parts In-Stock

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8,326

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Digiode

USA . 468 parts In-Stock

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468

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Bristol Electronics

USA . 11 parts In-Stock

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11

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Distributors (Availability)

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AZTECH Wire

Italy . 798 parts In-Stock

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$6.748

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798

$6.748

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Parana Technologies

USA . 2,374 parts In-Stock

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$9.371

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$9.992

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2,374

$9.371

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$9.992

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DigiPath Technology Company

USA . 447 parts In-Stock

1+ parts

$10.318

100+ parts

$9.493

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447

$10.318

$9.493

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ChromeModa Solutions

Germany . 5,257 parts In-Stock

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$10.529

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$8.634

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5,257

$10.529

$8.634

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IDEA Electronic Components Group

UK . 987 parts In-Stock

1+ parts

$10.529

100+ parts

$10.003

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$9.476

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987

$10.529

$10.003

$9.476

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One Stop Electronics

USA . 671 parts In-Stock

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$12.000

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671

$12.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 3,459 parts In-Stock

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Northwest PG Solutions

USA . 555 parts In-Stock

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$3.685

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555

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$3.685

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Microchip USA

USA . 241 parts In-Stock

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Native Components

USA . 76 parts In-Stock

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$3.647

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76

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$3.647

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Overview

Experience high-quality analog-to-digital conversion with the ADS8342IBPFBR by Texas Instruments. Known for their superior manufacturing standards, Texas Instruments delivers reliable products that meet industrial-grade requirements. This versatile ADC boasts 4 analog input channels and a 16-bit resolution, making it ideal for a wide range of applications. With a fast conversion time and low linearity error, customers can trust in the accuracy and efficiency of this device. Upgrade your system with the ADS8342IBPFBR and unlock new possibilities for precision measurement and control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

No. of Analog In Channels: 4

Allows for multiple inputs to be converted to digital signals simultaneously, increasing efficiency.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards, saving space and enhancing manufacturability.

No. of Bits: 16

Offers high resolution and accuracy for converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0061 %

Ensures precise and consistent conversion of analog signals, resulting in accurate digital output.

Power Supplies (V): +-5

Provides a stable power source for the ADC, improving performance and reliability.

No. of Terminals: 48

Enables connection to multiple external devices and components for versatile applications.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Streamlined design for compact installation and improved thermal performance.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold environments.

Terminal Position: QUAD

Optimizes PCB layout and minimizes signal interference for improved performance.

Maximum Conversion Time: 34 us

Delivers fast and efficient conversion of analog signals to digital data.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width: 7 mm

Compact size for easy integration into electronic systems.

Length: 7 mm

Compact size for easy integration into electronic systems.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Maximum Analog Input Voltage: 2.55 V

Accommodates a wide range of analog input signals for versatility.

Sample Rate: 0.25 MHz

Provides high-speed sampling for real-time data conversion.

Technology: CMOS

Offers low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

Facilitates easy soldering and installation on PCBs.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Employs a proven conversion method for accurate and efficient analog-to-digital conversion.

Nominal Supply Voltage: 5 V

Standard voltage for compatibility with a wide range of electronic systems.

Output Bit Code: 2'S COMPLEMENT BINARY

Provides a common and efficient format for digital output.

Nominal Negative Supply Voltage: -5 V

Ensures balanced power supply for safe and reliable operation.

Terminal Pitch: 0.5 mm

Optimizes PCB layout and signal integrity for improved performance.

Minimum Analog Input Voltage: -2.55 V

Accommodates a wide range of analog input signals for versatility.

Output Format: PARALLEL, WORD

Provides easily interpretable digital output for further processing.

Sample and Hold/Track and Hold: SAMPLE

Provides precise sampling of analog signals for accurate conversion to digital data.

Technical Specifications

Analog-to-Digital Converters ADS8342IBPFBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

250 kHz

Hold Mode:

Sample

Maximum Conversion Time:

34 µs

Electrical Specifications

Power Supplies:

±5 V

Minimum Analog Input Voltage:

-2.55 V

Maximum Analog Input Voltage:

2.55 V

Nominal Supply Voltage:

5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

Trade Compliance

ADS8342IBPFBR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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