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ADS8331IRGER

Texas Instruments

ADS8331IRGER by Texas Instruments

The Texas Instruments ADS8331IRGER is a 16-bit ADC with 4 analog input channels, 0.5 MHz sample rate, and 0.0046% max linearity error. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact chip carrier package. Operating temperature range from -40 to 85°C makes it suitable for various environments.

Median Price

$8.217

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,760 parts In-Stock

1+ parts

$8.217

100+ parts

$7.178

1k+ parts

$4.950

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8,760

$8.217

$7.178

$4.950

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Distributors (In-Stock)

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Nova Conductors

Japan . 39 parts In-Stock

1+ parts

$7.620

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39

$7.620

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Digiode

USA . 4,240 parts In-Stock

1+ parts

$7.806

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4,240

$7.806

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VNN

France . 31,881 parts In-Stock

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Chip Stock

USA . 7,559 parts In-Stock

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7,559

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Vyrian

USA . 5,475 parts In-Stock

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5,475

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Prism Electronics

USA . 70 parts In-Stock

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70

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ACDS - Activité Composants Distribution Service

France . 15 parts In-Stock

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Distributors (Availability)

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Vigor

Singapore . 6,039 parts In-Stock

1+ parts

$6.670

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-

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6,039

$6.670

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Semicontronic

India . 8,477 parts In-Stock

1+ parts

$6.980

100+ parts

$6.806

1k+ parts

$6.771

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8,477

$6.980

$6.806

$6.771

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Corphita

USA . 2,201 parts In-Stock

1+ parts

$7.395

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2,201

$7.395

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Continental Prestige Electronics

USA . 428 parts In-Stock

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$7.620

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$7.468

428

$7.620

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$7.468

Netroflash

USA . 50 parts In-Stock

1+ parts

$7.620

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$7.468

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50

$7.620

$7.468

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AZTECH Wire

Italy . 649 parts In-Stock

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$8.130

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649

$8.130

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Ampacity Inc.

Singapore . 8,518 parts In-Stock

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$15.200

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$15.200

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Parana Technologies

USA . 1,132 parts In-Stock

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$21.000

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$21.224

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$21.000

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Corohmni

South Africa . 283 parts In-Stock

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$22.038

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283

$22.038

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DigiPath Technology Company

USA . 110 parts In-Stock

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$23.124

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$21.274

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110

$23.124

$21.274

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IDEA Electronic Components Group

UK . 2,331 parts In-Stock

1+ parts

$23.596

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$22.416

1k+ parts

$21.236

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2,331

$23.596

$22.416

$21.236

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ChromeModa Solutions

Germany . 1,819 parts In-Stock

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$23.596

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$19.349

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1,819

$23.596

$19.349

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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32,000

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Kepictronics

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,250 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,600 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

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Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

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Overview

Enhance your analog-to-digital conversion experience with the ADS8331IRGER by Texas Instruments. Crafted with top-notch quality and precision, this ADC offers unparalleled performance in a compact square package. Ideal for applications requiring up to 4 analog input channels, this chip carrier device operates at an industrial temperature grade and boasts a fast conversion time of just 2 microseconds. With a low power consumption of only 0.5 mA and a wide supply voltage range, the ADS8331IRGER delivers exceptional value, accuracy, and reliability to meet your diverse project needs. Elevate your designs with Texas Instruments' trusted expertise and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, suitable for portable applications.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile input options and flexibility in the data acquisition process.

Surface Mount: YES

Surface mount capability simplifies the PCB assembly process and saves space on the board.

No. of Bits: 16

With 16 bits resolution, the converter can provide higher accuracy in digital conversions of analog signals.

Power Supplies (V): 2.7/5

Support for multiple power supply voltages allows for compatibility with a wide range of systems and applications.

Maximum Analog Input Voltage: 4.2 V

Ability to handle up to 4.2V analog input voltage allows for measurement of a wide range of signals without distortion.

Sample Rate: 0.5 MHz

High sampling rate of 0.5 MHz ensures accurate capture of fast-changing analog signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the converter.

Technical Specifications

Analog-to-Digital Converters ADS8331IRGER attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0046 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

500 μA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.157 in (4 mm)

Length:

0.157 in (4 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC24,.16SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8331IRGER Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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