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ADS8330IBPWG4

Texas Instruments

ADS8330IBPWG4 by Texas Instruments

Texas Instruments ADS8330IBPWG4 is a 16-bit ADC with 2 analog in channels, operating at a sample rate of 1 MHz. It features a max linearity error of 0.0027%, suitable for industrial applications requiring precise analog-to-digital conversion within the temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,248 parts In-Stock

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Digiode

USA . 1,833 parts In-Stock

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1,833

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Component Sense

UK . 850 parts In-Stock

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850

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Distributors (Availability)

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AZTECH Wire

Italy . 733 parts In-Stock

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$15.389

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733

$15.389

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One Stop Electronics

USA . 786 parts In-Stock

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$16.000

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786

$16.000

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Parana Technologies

USA . 1,119 parts In-Stock

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$24.576

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$25.243

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$24.576

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$25.243

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DigiPath Technology Company

USA . 1,178 parts In-Stock

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$27.062

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$24.897

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1,178

$27.062

$24.897

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ChromeModa Solutions

Germany . 2,838 parts In-Stock

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$27.614

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$22.643

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2,838

$27.614

$22.643

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IDEA Electronic Components Group

UK . 650 parts In-Stock

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$27.614

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$26.233

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$24.853

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650

$27.614

$26.233

$24.853

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Component Stockers USA

USA . 723 parts In-Stock

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$99.990

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$99.990

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Microchip USA

USA . 4,525 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,315 parts In-Stock

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Corphita

USA . 2,938 parts In-Stock

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Northwest PG Solutions

USA . 2,326 parts In-Stock

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Native Components

USA . 616 parts In-Stock

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Overview

Unlock the power of precise data conversion with the ADS8330IBPWG4 by Texas Instruments. As a leader in innovative technology, Texas Instruments delivers unparalleled quality and reliability in their Analog-to-Digital Converters. Perfect for industrial applications, this 16-bit ADC offers fast conversion times and low linearity error, ensuring accurate results every time. Experience the value of superior performance and efficiency with the ADS8330IBPWG4, setting a new standard in data acquisition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy construction makes the package lightweight and durable, making it ideal for portable or rugged applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more flexibility in connecting multiple sources for conversion, expanding the functionality of the product.

Surface Mount: YES

Surface mount capability allows for easy and secure integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 16

With 16 bits resolution, this ADC offers high precision and accuracy in converting analog signals to digital, making it suitable for demanding applications.

Maximum Linearity Error (EL): 0.0027 %

The low linearity error ensures accurate conversion of analog signals to digital data, improving the quality of the output.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages (3.3V and 5V) provides flexibility in powering the device and compatibility with a variety of systems.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and integration into circuit designs, facilitating smooth operation and compatibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package offer space-saving benefits and ease of assembly in compact electronic devices.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage requirement makes this ADC suitable for low-power applications and allows for operation in battery-powered devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments or industrial settings.

Technical Specifications

Analog-to-Digital Converters ADS8330IBPWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0027 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

786 ns

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

6.1 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8330IBPWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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