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ADS8329IBRSATG4

Texas Instruments

ADS8329IBRSATG4 by Texas Instruments

The Texas Instruments ADS8329IBRSATG4 is a 16-bit ADC with 0.0027% linearity error, operating at 1 MHz sample rate. It features a supply voltage range of 1.65-5V and industrial temperature grade. Ideal for applications requiring precise analog-to-digital conversion in compact spaces with its small form factor and low power consumption of 6.1 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,870 parts In-Stock

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8,870

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Digiode

USA . 2,208 parts In-Stock

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2,208

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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VNN

France . 402 parts In-Stock

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402

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One Stop Electronics

USA . 1,424 parts In-Stock

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$1.000

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$1.000

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Semicontronic

India . 1,246 parts In-Stock

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$14.000

100+ parts

$13.650

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$13.580

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1,246

$14.000

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$13.580

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Parana Technologies

USA . 194 parts In-Stock

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$15.130

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$15.536

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194

$15.130

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$15.536

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AZTECH Wire

Italy . 646 parts In-Stock

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$16.345

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646

$16.345

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DigiPath Technology Company

USA . 1,271 parts In-Stock

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$16.660

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$15.327

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$15.327

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IDEA Electronic Components Group

UK . 1,620 parts In-Stock

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$17.000

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$16.150

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$15.300

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1,620

$17.000

$16.150

$15.300

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ChromeModa Solutions

Germany . 791 parts In-Stock

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$17.000

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$13.940

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Ampacity Inc.

Singapore . 1,343 parts In-Stock

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$37.000

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Continental Prestige Electronics

USA . 4,094 parts In-Stock

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Argo Parts USA

USA . 2,395 parts In-Stock

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Corphita

USA . 2,373 parts In-Stock

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Microchip USA

USA . 2,162 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience the precision and reliability of Texas Instruments with the ADS8329IBRSATG4 Analog-to-Digital Converter. Perfect for industrial applications, this 16-bit ADC offers unmatched accuracy with a maximum linearity error of only 0.0027%. With a compact chip carrier package and low power consumption, this converter provides fast conversion times and high performance. Trust Texas Instruments for exceptional quality and performance in every application. Elevate your designs with the ADS8329IBRSATG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to environmental factors, making the product long-lasting.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during production.

No. of Bits: 16

Provides high resolution for accurate conversion of analog signals to digital data.

Maximum Linearity Error (EL): 0.0027%

Ensures precise and reliable conversion of signals with minimal distortion.

Power Supplies (V): 3.3,5

Compatibility with multiple power supply voltages allows for flexibility in various applications.

No. of Terminals: 16

Sufficient terminals for connecting to external components and interfaces without the need for additional adaptors.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer versatility in design and integration into different systems.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage requirement enables operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, ensuring reliability in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for improved conductivity and corrosion resistance, extending product lifespan.

Maximum Conversion Time: 0.786 us

Fast conversion time allows for real-time data processing and efficiency in applications.

Width: 4 mm

Compact size saves space on circuit boards, ideal for miniaturized devices.

Sample Rate: 1 MHz

High sample rate enables the capture of fast-changing input signals with accuracy.

Technology: CMOS

CMOS technology offers low power consumption and compatibility with a wide range of digital systems.

Maximum Supply Current: 6.1 mA

Low supply current requirement reduces power consumption and heat generation.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC provides accurate and efficient conversion of analog signals to digital data.

Output Bit Code: BINARY

Binary output format is widely compatible with digital systems for seamless integration.

Minimum Analog Input Voltage: 0 V

Accepts zero analog input voltage, suitable for various sensor applications.

Output Format: SERIAL

Serial output format allows for easy interfacing with microcontrollers and other digital devices.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold circuit helps to accurately capture and maintain analog input values during conversion.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture, suitable for indoor and some outdoor applications.

Technical Specifications

Analog-to-Digital Converters ADS8329IBRSATG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0027 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

786 ns

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

6.1 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Quad

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.157 in (4 mm)

Length:

0.157 in (4 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC16,.16SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8329IBRSATG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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