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ADS8329IBRSAT

Texas Instruments

ADS8329IBRSAT by Texas Instruments

Texas Instruments' ADS8329IBRSAT is a 16-bit ADC with 0.0027% EL, operating at 1MHz sample rate. Ideal for industrial applications, it offers a max analog input voltage of 5.5V and operates in the -40 to 85°C temperature range. With a compact square package style and low power consumption of 6.1mA, it's suitable for various precision measurement systems.

Median Price

$17.299

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 238 parts In-Stock

1+ parts

$13.294

100+ parts

$12.819

1k+ parts

-

10k+ parts

-

238

$13.294

$12.819

-

-

Texas Instruments

USA . 13,498 parts In-Stock

1+ parts

$16.198

100+ parts

$14.149

1k+ parts

$9.758

10k+ parts

-

13,498

$16.198

$14.149

$9.758

-

Verical

USA . 13 parts In-Stock

1+ parts

$18.400

100+ parts

-

1k+ parts

-

10k+ parts

-

13

$18.400

-

-

-

Mouser Electronics

USA . 680 parts In-Stock

1+ parts

$24.360

100+ parts

$17.050

1k+ parts

$16.420

10k+ parts

-

680

$24.360

$17.050

$16.420

-

DigiKey

USA . 488 parts In-Stock

1+ parts

$24.360

100+ parts

$17.050

1k+ parts

$16.044

10k+ parts

-

488

$24.360

$17.050

$16.044

-

Chip1Stop

Japan . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.901

10k+ parts

-

250

-

-

$11.901

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,391 parts In-Stock

1+ parts

$12.629

100+ parts

-

1k+ parts

-

10k+ parts

-

1,391

$12.629

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$15.010

100+ parts

-

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-

10k+ parts

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50

$15.010

-

-

-

Vyrian

USA . 7,254 parts In-Stock

1+ parts

-

100+ parts

-

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7,254

-

-

-

-

Chip Stock

USA . 4,125 parts In-Stock

1+ parts

-

100+ parts

-

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4,125

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 791 parts In-Stock

1+ parts

$11.965

100+ parts

-

1k+ parts

-

10k+ parts

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791

$11.965

-

-

-

Parana Technologies

USA . 495 parts In-Stock

1+ parts

$21.266

100+ parts

-

1k+ parts

$21.572

10k+ parts

-

495

$21.266

-

$21.572

-

DigiPath Technology Company

USA . 114 parts In-Stock

1+ parts

$23.416

100+ parts

-

1k+ parts

-

10k+ parts

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114

$23.416

-

-

-

ChromeModa Solutions

Germany . 3,705 parts In-Stock

1+ parts

$23.894

100+ parts

$19.593

1k+ parts

-

10k+ parts

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3,705

$23.894

$19.593

-

-

IDEA Electronic Components Group

UK . 2,349 parts In-Stock

1+ parts

$23.894

100+ parts

$22.699

1k+ parts

$21.505

10k+ parts

-

2,349

$23.894

$22.699

$21.505

-

Microchip USA

USA . 2,397 parts In-Stock

1+ parts

$43.620

100+ parts

$43.000

1k+ parts

$42.690

10k+ parts

$42.370

2,397

$43.620

$43.000

$42.690

$42.370

Lixinc

USA . 8,427 parts In-Stock

1+ parts

-

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8,427

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Perfect Parts

USA . 2,788 parts In-Stock

1+ parts

-

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2,788

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-

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Northwest PG Solutions

USA . 1,424 parts In-Stock

1+ parts

-

100+ parts

-

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1,424

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-

-

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Native Components

USA . 140 parts In-Stock

1+ parts

-

100+ parts

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140

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Overview

Experience the unparalleled precision and reliability of the ADS8329IBRSAT Analog-to-Digital Converter by Texas Instruments. With a maximum linearity error of just 0.0027%, this high-quality product is perfect for industrial applications where accuracy is crucial. Benefit from its fast conversion time of 0.786 us and high sample rate of 1 MHz, ensuring real-time data acquisition. Trust in Texas Instruments' reputation for excellence in semiconductor manufacturing, and elevate your projects with the ADS8329IBRSAT's outstanding performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost during production.

No. of Bits: 16

With a high resolution of 16 bits, this ADC can provide precise and accurate conversion of analog signals.

Maximum Linearity Error (EL): 0.0027 %

The low linearity error ensures high accuracy and reliability in converting analog signals to digital, making it suitable for critical applications.

Power Supplies (V): 3.3,5

Support for multiple power supply voltages gives flexibility in system design and integration.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles cater to different application needs, offering versatility in installation and thermal management.

Maximum Conversion Time: 0.786 us

The fast conversion time allows for real-time data processing and high-speed operation.

Maximum Analog Input Voltage: 5.5 V

The high maximum analog input voltage range accommodates a wide variety of input signals, enhancing the versatility of the ADC.

Technical Specifications

Analog-to-Digital Converters ADS8329IBRSAT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0027 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

786 ns

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

6.1 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.157 in (4 mm)

Length:

0.157 in (4 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC16,.16SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8329IBRSAT Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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