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ADS8325IDGKTG4

Texas Instruments

ADS8325IDGKTG4 by Texas Instruments

Texas Instruments ADS8325IDGKTG4 is a 16-bit ADC with 0.0092% EL, 0-5V supplies, and 0.1 MHz sample rate. Ideal for industrial applications, it features a small outline package with dual terminals and operates b/w -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,240 parts In-Stock

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Digiode

USA . 4,345 parts In-Stock

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4,345

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Vyrian

USA . 3,539 parts In-Stock

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3,539

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VNN

France . 3,299 parts In-Stock

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3,299

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,032 parts In-Stock

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$2.000

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$2.000

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AZTECH Wire

Italy . 436 parts In-Stock

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$5.977

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436

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Corohmni

South Africa . 16 parts In-Stock

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$6.178

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16

$6.178

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Parana Technologies

USA . 2,075 parts In-Stock

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$11.118

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$11.572

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$11.118

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$11.572

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DigiPath Technology Company

USA . 2,198 parts In-Stock

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$12.242

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$12.242

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ChromeModa Solutions

Germany . 1,604 parts In-Stock

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$12.492

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$10.243

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$12.492

$10.243

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IDEA Electronic Components Group

UK . 1,491 parts In-Stock

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$12.492

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$11.867

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$11.243

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$12.492

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Ampacity Inc.

Singapore . 1,238 parts In-Stock

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$31.000

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Component Stockers USA

USA . 540 parts In-Stock

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$99.990

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$99.990

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Continental Prestige Electronics

USA . 5,888 parts In-Stock

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Argo Parts USA

USA . 2,020 parts In-Stock

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Microchip USA

USA . 1,622 parts In-Stock

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Corphita

USA . 1,158 parts In-Stock

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1,158

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Unlock the power of precision with the Texas Instruments ADS8325IDGKTG4 Analog-to-Digital Converter. Crafted by a renowned manufacturer, this high-quality device offers unparalleled accuracy and reliability. Ideal for a wide range of applications, this converter provides fast and efficient conversion with minimal power consumption. Experience the value and benefits of superior performance with the ADS8325IDGKTG4 from Texas Instruments. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the analog-to-digital converter, ensuring long-term reliability.

No. of Bits: 16

With 16 bits of resolution, this ADC can provide high accuracy and precision in converting analog signals to digital data.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows this ADC to function effectively in various environmental conditions, making it suitable for industrial applications.

Sample Rate: 0.1 MHz

The high sample rate of 0.1 MHz ensures that the ADC can accurately capture and convert fast-changing analog signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this ADC energy-efficient and reliable in noisy environments.

Output Format: SERIAL

Having a serial output format simplifies data transmission and interfacing with other digital systems, enhancing the overall usability of the ADC.

Technical Specifications

Analog-to-Digital Converters ADS8325IDGKTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0092 %

Sample Rate:

100 kHz

Hold Mode:

Sample

Maximum Conversion Time:

666.7 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

1.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP8,.19

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8325IDGKTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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