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ADS8318IDGSTG4

Texas Instruments

ADS8318IDGSTG4 by Texas Instruments

Texas Instruments ADS8318IDGSTG4 is a 16-bit ADC with 0.0023% EL, operating at 5V. It features a sample rate of 0.5 MHz and max conversion time of 1.4 us. Ideal for industrial applications requiring precise analog-to-digital conversion in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

VNN

France . 2,672 parts In-Stock

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2,672

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Vyrian

USA . 2,422 parts In-Stock

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2,422

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Digiode

USA . 810 parts In-Stock

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810

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,331 parts In-Stock

1+ parts

$4.000

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1,331

$4.000

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Parana Technologies

USA . 1,649 parts In-Stock

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$5.721

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$6.515

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1,649

$5.721

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$6.515

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ChromeModa Solutions

Germany . 3,377 parts In-Stock

1+ parts

$6.428

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$5.271

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3,377

$6.428

$5.271

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IDEA Electronic Components Group

UK . 1,248 parts In-Stock

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$6.428

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$5.785

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$6.428

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$5.785

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AZTECH Wire

Italy . 492 parts In-Stock

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$16.865

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492

$16.865

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One Stop Electronics

USA . 702 parts In-Stock

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$36.000

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702

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Argo Parts USA

USA . 4,423 parts In-Stock

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Microchip USA

USA . 2,067 parts In-Stock

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Corphita

USA . 1,597 parts In-Stock

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DigiPath Technology Company

USA . 1,387 parts In-Stock

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$5.795

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$5.795

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Continental Prestige Electronics

USA . 952 parts In-Stock

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952

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Unlock the power of precise analog-to-digital conversion with the ADS8318IDGSTG4 by Texas Instruments, a trusted leader in semiconductor technology. Ideal for industrial applications, this 16-bit ADC offers unparalleled accuracy and speed, with a maximum linearity error of only 0.0023%. With a small outline and thin profile package design, this converter is easy to integrate into your system for reliable performance in a variety of environments. Trust Texas Instruments for quality and innovation, and experience the benefits of superior data acquisition with the ADS8318IDGSTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the internal components of the converter.

No. of Bits: 16

High resolution of 16 bits allows for more detailed and accurate conversion of analog signals.

Maximum Linearity Error (EL): 0.0023 %

Low linearity error ensures accurate conversion of analog signals with minimal distortion.

Maximum Operating Temperature: 85 °C

Wide operating temperature range makes it suitable for industrial applications where temperature variations may occur.

Maximum Conversion Time: 1.4 us

Fast conversion time enables quick processing of analog input signals.

Maximum Analog Input Voltage: 5.6 V

High input voltage range allows for versatile compatibility with different signal sources.

Sample Rate: 0.5 MHz

High sample rate ensures accurate capture of fast-changing analog signals.

Technical Specifications

Analog-to-Digital Converters ADS8318IDGSTG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0023 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.4 µs

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

-2.048 V

Maximum Analog Input Voltage:

5.6 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

4.5 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

10

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP10,.19,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G10

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8318IDGSTG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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