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ADS8317IDRBR

Texas Instruments

ADS8317IDRBR by Texas Instruments

Texas Instruments ADS8317IDRBR is a 16-bit ADC with 0.0031% EL, 2.7/5V supplies, and 0.25 MHz sample rate. Ideal for industrial applications, it features a small outline package and operates b/w -40 to 85°C.

Median Price

$8.034

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,950 parts In-Stock

1+ parts

$8.034

100+ parts

$7.018

1k+ parts

$4.840

10k+ parts

-

17,950

$8.034

$7.018

$4.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,386 parts In-Stock

1+ parts

$7.632

100+ parts

-

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1,386

$7.632

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Vyrian

USA . 4,972 parts In-Stock

1+ parts

-

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4,972

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Chip Stock

USA . 235 parts In-Stock

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235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,883 parts In-Stock

1+ parts

$7.231

100+ parts

-

1k+ parts

-

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3,883

$7.231

-

-

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AZTECH Wire

Italy . 465 parts In-Stock

1+ parts

$16.050

100+ parts

-

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465

$16.050

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Parana Technologies

USA . 1,240 parts In-Stock

1+ parts

$16.635

100+ parts

-

1k+ parts

$16.904

10k+ parts

-

1,240

$16.635

-

$16.904

-

Microchip USA

USA . 5,752 parts In-Stock

1+ parts

$18.150

100+ parts

$17.890

1k+ parts

$17.760

10k+ parts

$17.630

5,752

$18.150

$17.890

$17.760

$17.630

ChromeModa Solutions

Germany . 6,403 parts In-Stock

1+ parts

$18.691

100+ parts

$15.327

1k+ parts

-

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6,403

$18.691

$15.327

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IDEA Electronic Components Group

UK . 2,048 parts In-Stock

1+ parts

$18.691

100+ parts

$17.756

1k+ parts

$16.822

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-

2,048

$18.691

$17.756

$16.822

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Northwest PG Solutions

USA . 1,949 parts In-Stock

1+ parts

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1,949

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DigiPath Technology Company

USA . 1,708 parts In-Stock

1+ parts

-

100+ parts

$16.852

1k+ parts

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1,708

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$16.852

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Native Components

USA . 628 parts In-Stock

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628

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Kepictronics

USA . 47 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the ADS8317IDRBR by Texas Instruments. Crafted with precision and expertise, this converter offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with seamless functionality, high performance, and utmost value. Whether you're in the industrial sector or working on advanced projects, the ADS8317IDRBR guarantees efficiency and accuracy every time. Choose Texas Instruments for cutting-edge technology that delivers exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration onto circuit boards, saving space and facilitating automated assembly processes.

No. of Bits: 16

This high number of bits allows for precise and accurate conversion of analog signals into digital data, suitable for applications requiring high resolution.

Maximum Linearity Error (EL): 0.0031%

The low maximum linearity error ensures that the converter provides accurate and reliable digital output, crucial for critical measurements and control systems.

Power Supplies (V): 2.7/5

The wide range of power supply options makes the converter versatile and adaptable to different operating environments and requirements.

No. of Terminals: 8

The compact size with a small number of terminals simplifies the integration and connection of the converter within a circuit, reducing complexity and potential points of failure.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style allows for efficient heat dissipation and space-saving design, ideal for compact electronic devices.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement makes the converter suitable for low-power or portable applications, increasing its flexibility in various use cases.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures the converter's reliability and performance in harsh environmental conditions or industrial settings.

Minimum Operating Temperature: -40 °C

The wide temperature range enables the converter to operate effectively in extreme cold conditions, expanding its use in various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission and long-term durability.

Maximum Conversion Time: 666.7 us

The fast maximum conversion time allows for quick and real-time processing of analog signals, making the converter suitable for high-speed applications.

Maximum Seated Height: 1 mm

The low maximum seated height facilitates the compact design and integration of the converter in space-constrained electronic systems.

Width: 3 mm

The narrow width of the converter enables a more efficient use of PCB space, contributing to a compact and streamlined overall system design.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures that the converter can withstand soldering processes without any damage or performance degradation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable and robust solder joint connections during assembly, ensuring long-term operational reliability.

Length: 3 mm

The compact length of the converter complements its narrow width, contributing to an overall small footprint and efficient use of PCB space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating indicates that the converter is designed to withstand the rigors of industrial environments, ensuring durability and reliability in demanding applications.

Maximum Analog Input Voltage: 2.5 V

The high maximum analog input voltage handling capability makes the converter suitable for a wide range of signal levels, enhancing its versatility and compatibility with various sensors or devices.

Sample Rate: 0.25 MHz

The high sample rate allows for fast and accurate conversion of analog signals into digital data, making the converter suitable for applications requiring real-time processing and high-speed data acquisition.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high speed, and compatibility with a wide range of digital systems, making the converter an efficient and modern choice for signal conversion.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder joint failures, enhancing the reliability and longevity of the converter in use.

Maximum Supply Current: 3 mA

The low maximum supply current requirement minimizes power consumption and heat generation, making the converter energy-efficient and suitable for battery-powered or low-power applications.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type ensures high speed and accuracy in analog-to-digital conversion, making the converter suitable for applications requiring precise measurements and fast response times.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage provides a stable operating voltage for the converter, ensuring consistent and reliable performance in various operating conditions.

Output Bit Code: 2'S COMPLEMENT BINARY

The 2's complement binary output bit code format allows for easy interpretation and processing of digital data, making the converter compatible with standard digital systems and protocols.

Terminal Pitch: 0.65 mm

The small terminal pitch simplifies the PCB layout and enables high-density mounting, contributing to a compact and efficient overall system design.

Minimum Analog Input Voltage: -1.25 V

The low minimum analog input voltage handling capability allows the converter to accurately capture and process a wide range of signal levels, making it versatile and suitable for diverse applications.

Output Format: SERIAL

The serial output format allows for easy interfacing with digital devices and systems, facilitating data transmission and integration in modern electronic setups.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold functionality enables the converter to capture and hold analog input signals at a specific time, ensuring accurate and stable conversion, particularly in dynamic signal environments.

Moisture Sensitivity Level (MSL): 2

The low moisture sensitivity level indicates that the converter is resistant to moisture-related damage during handling and assembly processes, ensuring reliability and longevity in various operating conditions.

Technical Specifications

Analog-to-Digital Converters ADS8317IDRBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0031 %

Sample Rate:

250 kHz

Hold Mode:

Sample

Maximum Conversion Time:

666.7 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

-1.25 V

Maximum Analog Input Voltage:

2.5 V

Nominal Supply Voltage:

2.7 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

3 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

SOLCC8,.12,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-N8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8317IDRBR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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