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ADS809Y/250

Texas Instruments

ADS809Y/250 by Texas Instruments

The Texas Instruments ADS809Y/250 is a 12-bit ADC with 80 MHz sample rate and 1 us conversion time. Ideal for industrial applications, it operates at -40 to 85 °C with a supply voltage of 5 V. The converter features offset binary output and GULL WING terminals in a compact square package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,604 parts In-Stock

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5,604

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VNN

France . 2,611 parts In-Stock

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2,611

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Digiode

USA . 1,875 parts In-Stock

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1,875

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$18.897

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682

$18.897

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Parana Technologies

USA . 180 parts In-Stock

1+ parts

$23.908

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$24.543

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180

$23.908

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$24.543

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DigiPath Technology Company

USA . 1,668 parts In-Stock

1+ parts

$26.326

100+ parts

$24.220

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1,668

$26.326

$24.220

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ChromeModa Solutions

Germany . 2,433 parts In-Stock

1+ parts

$26.863

100+ parts

$22.028

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2,433

$26.863

$22.028

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IDEA Electronic Components Group

UK . 2,190 parts In-Stock

1+ parts

$26.863

100+ parts

$25.520

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$24.177

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2,190

$26.863

$25.520

$24.177

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Ampacity Inc.

Singapore . 265 parts In-Stock

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$34.000

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265

$34.000

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Vigor

Singapore . 1,798 parts In-Stock

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$37.000

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1,798

$37.000

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One Stop Electronics

USA . 454 parts In-Stock

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$38.000

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454

$38.000

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Corphita

USA . 4,934 parts In-Stock

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4,934

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Perfect Parts

USA . 533 parts In-Stock

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533

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Microchip USA

USA . 306 parts In-Stock

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306

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Elevate your analog-to-digital conversion with the ADS809Y/250 by Texas Instruments. Crafted with precision and expertise, this product offers unparalleled quality and reliability. Perfect for a wide range of applications, this ADC provides fast and accurate results, making it a valuable asset for professionals seeking high-performance solutions. Experience the benefits of Texas Instrument's cutting-edge technology and elevate your projects to new heights with the ADS809Y/250.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a suitable choice for various applications.

Surface Mount: YES

This feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

The square shape helps optimize space on the circuit board, making it efficient for compact designs.

No. of Bits: 12

With 12 bits, this ADC offers high resolution for accurate conversion of analog signals, ideal for applications requiring precision.

Maximum Linearity Error (EL): 0.1709%

The low linearity error ensures accurate conversion of analog signals into digital data, making this ADC reliable for critical measurements.

Power Supplies (V): 5

Operates on a standard voltage of 5V, making it compatible with a wide range of systems and easy to integrate into existing designs.

No. of Terminals: 48

With 48 terminals, this ADC offers versatile connectivity options for various input and output configurations.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The variety of package styles available enhances compatibility with different system requirements, providing flexibility in design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can withstand harsh environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance in extreme cold environments, making it a durable choice for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances conductivity and corrosion resistance, ensuring long-term reliability in operation.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and assembly, facilitating a streamlined design process and reducing production costs.

Maximum Conversion Time: 1 us

With a fast conversion time of 1 microsecond, this ADC can quickly process analog signals, ideal for high-speed applications.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact and space-efficient designs, making it suitable for applications with limited space constraints.

Width: 7 mm

The slim width of 7mm enables a compact footprint on the circuit board, optimizing space for other components in the system.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds minimizes heat exposure during assembly, helping to prevent damage to the ADC.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this ADC can withstand the soldering process without compromising performance, ensuring reliable functionality post-assembly.

Length: 7 mm

The compact length of 7mm contributes to a smaller overall footprint on the circuit board, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Rated for industrial temperatures, this ADC is reliable in demanding conditions, making it suitable for rugged applications.

Maximum Analog Input Voltage: 2 V

With a high maximum analog input voltage, this ADC can handle a wide range of input signals, accommodating diverse signal levels.

Sample Rate: 80 MHz

The high sample rate of 80 MHz allows for fast and accurate conversion of analog signals, making this ADC suitable for high-frequency applications.

Technology: CMOS

The CMOS technology offers low power consumption and high integration, making this ADC energy-efficient and cost-effective.

Terminal Form: GULL WING

The gull-wing terminal form simplifies board mounting and soldering, enhancing ease of assembly and reducing production time.

Converter Type: ADC, PROPRIETARY METHOD

Using a proprietary conversion method ensures unique performance characteristics tailored to specific application requirements, making this ADC a versatile choice.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage, this ADC is compatible with common power sources, simplifying system integration.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Offering multiple output bit code options allows for flexibility in data representation, supporting various system requirements.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, this ADC enables high-density mounting, maximizing component placement on the PCB for efficient design.

Minimum Analog Input Voltage: 1 V

The low minimum analog input voltage allows for precise measurement of small signals, making this ADC suitable for sensitive applications.

Output Format: PARALLEL, WORD

Providing both parallel and word output formats enhances compatibility with different systems, offering versatility in data output options.

Sample and Hold/Track and Hold: TRACK

The track-and-hold function ensures accurate signal capture during the conversion process, maintaining data integrity and precision.

Moisture Sensitivity Level (MSL): 3

With a moderate MSL of 3, this ADC can withstand typical levels of moisture exposure, ensuring reliable performance in various environments.

Technical Specifications

Analog-to-Digital Converters ADS809Y/250 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1709 %

Sample Rate:

80 MHz

Hold Mode:

Track

Maximum Conversion Time:

1 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

1 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS809Y/250 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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