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ADS808Y/250G4

Texas Instruments

ADS808Y/250G4 by Texas Instruments

Texas Instruments ADS808Y/250G4 ADC features 12-bit resolution, 70 MHz sample rate, and 5V supply voltage. Ideal for industrial applications, this CMOS converter offers a fast conversion time of 1us and operates in temperatures ranging from -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,258 parts In-Stock

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9,258

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Digiode

USA . 173 parts In-Stock

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173

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Distributors (Availability)

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Native Components

USA . 885 parts In-Stock

1+ parts

$0.684

100+ parts

-

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885

$0.684

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Northwest PG Solutions

USA . 840 parts In-Stock

1+ parts

$0.752

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840

$0.752

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One Stop Electronics

USA . 153 parts In-Stock

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$4.000

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153

$4.000

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Parana Technologies

USA . 1,731 parts In-Stock

1+ parts

$7.807

100+ parts

$725.006

1k+ parts

$7.026

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1,731

$7.807

$725.006

$7.026

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DigiPath Technology Company

USA . 1,550 parts In-Stock

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$8.597

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1,550

$8.597

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ChromeModa Solutions

Germany . 3,106 parts In-Stock

1+ parts

$8.772

100+ parts

$7.193

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3,106

$8.772

$7.193

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IDEA Electronic Components Group

UK . 1,692 parts In-Stock

1+ parts

$8.772

100+ parts

$8.333

1k+ parts

$7.895

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1,692

$8.772

$8.333

$7.895

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AZTECH Wire

Italy . 196 parts In-Stock

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$11.666

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196

$11.666

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Corphita

USA . 3,456 parts In-Stock

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3,456

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Microchip USA

USA . 368 parts In-Stock

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368

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Overview

Elevate your analog-to-digital conversion game with the ADS808Y/250G4 by Texas Instruments. Crafted with precision and expertise, this ADC offers unparalleled quality and reliability. Perfect for a wide range of applications, this converter ensures accurate and efficient data acquisition. Experience seamless performance and exceptional value with Texas Instruments' cutting-edge technology. Join the league of satisfied customers who have unlocked endless possibilities with the ADS808Y/250G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

No. of Bits: 12

The 12-bit resolution ensures high accuracy in converting analog signals to digital data, making it suitable for precision measurement and control systems.

Maximum Linearity Error (EL): 0.1709 %

With a low linearity error, the product provides reliable and accurate conversion of analog signals, ensuring high quality digital output.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with most power sources and easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

The wide operating temperature range makes the product suitable for use in various environments, including industrial settings where temperature fluctuations may occur.

Technical Specifications

Analog-to-Digital Converters ADS808Y/250G4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1709 %

Sample Rate:

70 MHz

Hold Mode:

Track

Maximum Conversion Time:

1 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

1 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP48,.35SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS808Y/250G4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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