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ADS7950SRGER

Texas Instruments

ADS7950SRGER by Texas Instruments

ADS7950SRGER by Texas Instruments is a 12-bit ADC with 4 analog input channels, operating at a sample rate of 1 MHz. It features a max linearity error of 0.0366%, suitable for automotive applications due to its temperature grade and low supply voltage requirements. This surface-mount chip carrier has a compact size of 4x4 mm, making it ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,768 parts In-Stock

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Digiode

USA . 2,476 parts In-Stock

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Vigor

Singapore . 1,767 parts In-Stock

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$2.830

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$2.830

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AZTECH Wire

Italy . 460 parts In-Stock

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$16.828

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460

$16.828

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Parana Technologies

USA . 1,889 parts In-Stock

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$18.291

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$18.425

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1,889

$18.291

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DigiPath Technology Company

USA . 1,496 parts In-Stock

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$20.141

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$18.530

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$20.141

$18.530

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ChromeModa Solutions

Germany . 1,304 parts In-Stock

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$20.552

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$16.853

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$20.552

$16.853

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IDEA Electronic Components Group

UK . 1,112 parts In-Stock

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$20.552

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$19.524

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$18.497

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$20.552

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$18.497

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Native Components

USA . 89 parts In-Stock

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$20.956

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$20.956

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Northwest PG Solutions

USA . 65 parts In-Stock

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$23.052

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$20.747

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65

$23.052

$20.747

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One Stop Electronics

USA . 858 parts In-Stock

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$38.000

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$38.000

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A-Z Elektronik GmbH

Germany . 9,126 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,717 parts In-Stock

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Corphita

USA . 906 parts In-Stock

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Microchip USA

USA . 159 parts In-Stock

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Kepictronics

USA . 74 parts In-Stock

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Overview

Get ready to take your analog-to-digital conversion to the next level with the ADS7950SRGER by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge technology in every product they create. This 12-bit ADC offers superior performance and accuracy, making it perfect for a wide range of applications. From automotive to industrial, this versatile converter provides fast and precise results, allowing you to streamline your designs and improve overall efficiency. Experience the value and benefits of Texas Instruments technology with the ADS7950SRGER.

Feature Benefit Bullets

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile input options and potential for multiple sensor connections.

No. of Bits: 12

With 12 bits of resolution, this ADC can provide high precision and accuracy in converting analog signals to digital.

Maximum Linearity Error (EL): 0.0366 %

The low linearity error ensures that the output digital data closely represents the input analog signal, leading to accurate conversion.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage allows for operation in low power applications or with limited power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this ADC can withstand harsh environmental conditions or extended operation without performance degradation.

Technology: CMOS

Utilizing CMOS technology enables low power consumption, high speed operation, and compatibility with a wide range of digital systems.

Sample Rate: 1 MHz

The high sample rate of 1 MHz allows for capturing fast-changing analog signals with high fidelity and accuracy.

Technical Specifications

Analog-to-Digital Converters ADS7950SRGER attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0366 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

800 ns

Electrical Specifications

Power Supplies:

1.8/5,3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

3.3 V

Minimum Supply Voltage:

1.7 V

Maximum Supply Current:

3 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.157 in (4 mm)

Length:

0.157 in (4 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC24,.16SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7950SRGER Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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