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ADS7871IDBG4

Texas Instruments

ADS7871IDBG4 by Texas Instruments

The Texas Instruments ADS7871IDBG4 is a 14-bit ADC with 8 analog input channels, 0.0122% linearity error, and 5V power supply. Ideal for industrial applications requiring high precision data conversion at temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,162 parts In-Stock

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Digiode

USA . 1,105 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 820 parts In-Stock

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$1.560

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820

$1.560

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Northwest PG Solutions

USA . 246 parts In-Stock

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$1.716

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$1.716

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AZTECH Wire

Italy . 495 parts In-Stock

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$15.135

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495

$15.135

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Parana Technologies

USA . 2,309 parts In-Stock

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$19.092

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$19.142

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$19.092

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DigiPath Technology Company

USA . 1,666 parts In-Stock

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$21.023

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$19.341

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$21.023

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ChromeModa Solutions

Germany . 6,953 parts In-Stock

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$21.452

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$17.591

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$21.452

$17.591

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IDEA Electronic Components Group

UK . 2,368 parts In-Stock

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$21.452

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$20.379

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$19.307

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One Stop Electronics

USA . 314 parts In-Stock

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$30.000

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Component Stockers USA

USA . 523 parts In-Stock

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$99.990

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 3,010 parts In-Stock

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Microchip USA

USA . 2,339 parts In-Stock

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Perfect Parts

USA . 112 parts In-Stock

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FE SAS

France . 2 parts In-Stock

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Overview

Discover the unparalleled precision and reliability of the Texas Instruments ADS7871IDBG4 Analog-to-Digital Converter. Designed with top-notch quality and cutting-edge technology, this product offers unmatched performance in a wide range of industrial applications. With 8 analog input channels and 14 bits resolution, this converter delivers accurate results with minimal linearity error. Its small outline package and low power consumption make it an ideal choice for space-constrained environments. Trust Texas Instruments to provide you with the best-in-class solutions for your analog-to-digital conversion needs. Unlock the potential of your projects with the ADS7871IDBG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body is lightweight and durable, making it ideal for portable and rugged applications.

No. of Analog In Channels: 8

Having 8 analog input channels allows for versatile input options, making it suitable for applications requiring multiple input signals to be converted.

Surface Mount: YES

Being surface mountable simplifies the installation process and reduces overall footprint, making it suitable for compact designs.

No. of Bits: 14

With 14 bits of resolution, this ADC can provide high accuracy and precision in converting analog signals to digital data.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for versatile use in industrial environments where temperature can fluctuate.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this ADC energy-efficient and reliable.

Technical Specifications

Analog-to-Digital Converters ADS7871IDBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0122 %

Sample Rate:

48 kHz

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-200 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Maximum Supply Current:

2 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7871IDBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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