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ADS7861IBRHBR

Texas Instruments

ADS7861IBRHBR by Texas Instruments

Texas Instruments ADS7861IBRHBR is a 12-bit ADC with 4 analog channels, 0.5 MHz sample rate, and 2.6V max analog input voltage. Ideal for automotive applications, it features a CMOS technology, operates b/w -40 to 125 °C, and has a compact square package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,230 parts In-Stock

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Digiode

USA . 950 parts In-Stock

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950

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Distributors (Availability)

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Native Components

USA . 780 parts In-Stock

1+ parts

$0.538

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780

$0.538

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Northwest PG Solutions

USA . 1,375 parts In-Stock

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$0.592

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$0.592

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Parana Technologies

USA . 130 parts In-Stock

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$8.877

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$9.559

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130

$8.877

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$9.559

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ChromeModa Solutions

Germany . 2,748 parts In-Stock

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$9.974

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$8.179

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2,748

$9.974

$8.179

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IDEA Electronic Components Group

UK . 837 parts In-Stock

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$9.974

100+ parts

$9.475

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$8.977

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837

$9.974

$9.475

$8.977

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AZTECH Wire

Italy . 540 parts In-Stock

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$17.310

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540

$17.310

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One Stop Electronics

USA . 1,482 parts In-Stock

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$28.000

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$28.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 1,667 parts In-Stock

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DigiPath Technology Company

USA . 1,636 parts In-Stock

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$8.993

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1,636

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Microchip USA

USA . 131 parts In-Stock

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Overview

Unlock the power of precision and reliability with Texas Instruments' ADS7861IBRHBR Analog-to-Digital Converter. Designed with cutting-edge technology and quality materials, this product offers unmatched performance in a compact package. Ideal for automotive applications and beyond, this converter provides fast and accurate data conversion, ensuring seamless operation in any environment. Trust in Texas Instruments to deliver top-of-the-line solutions that exceed expectations and elevate your projects to new heights. Experience the difference with the ADS7861IBRHBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Analog-to-Digital Converter, ensuring longevity and reliability.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile and multi-channel input capabilities, making it suitable for applications that require monitoring multiple signals.

Maximum Linearity Error (EL): 0.0244%

The low linearity error percentage ensures accurate and precise conversion of analog signals to digital data, making this product highly accurate in capturing input values.

Power Supplies (V): 5

Operating at a standard 5V power supply makes integration and compatibility with existing systems easier, offering convenience in power requirements.

Sample Rate: 0.5 MHz

The high sample rate of 0.5 MHz allows for fast and efficient conversion of analog signals, making it suitable for applications requiring real-time data conversion.

Technical Specifications

Analog-to-Digital Converters ADS7861IBRHBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

500 kHz

Hold Mode:

Sample

Maximum Conversion Time:

1.625 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-2.6 V

Maximum Analog Input Voltage:

2.6 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.197 in (5 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC32,.2SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7861IBRHBR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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