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ADS7850IRTET

Texas Instruments

ADS7850IRTET by Texas Instruments

ADS7850IRTET by Texas Instruments is a 14-bit ADC with 2 analog input channels, 0.75 MHz sample rate, and 0.59 us conversion time. It is used in automotive applications due to its -40 to 125 °C operating temperature range and low supply current of 9 mA. The package style includes chip carrier and very thin profile options for compact designs.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 7,254 parts In-Stock

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Digiode

USA . 3,948 parts In-Stock

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Parana Technologies

USA . 1,003 parts In-Stock

1+ parts

$15.057

100+ parts

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$15.469

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1,003

$15.057

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$15.469

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AZTECH Wire

Italy . 364 parts In-Stock

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$16.216

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$16.216

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DigiPath Technology Company

USA . 2,031 parts In-Stock

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$16.580

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$15.253

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$16.580

$15.253

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ChromeModa Solutions

Germany . 2,935 parts In-Stock

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$16.918

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$13.873

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$16.918

$13.873

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IDEA Electronic Components Group

UK . 742 parts In-Stock

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$16.918

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$16.072

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$15.226

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742

$16.918

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$15.226

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One Stop Electronics

USA . 420 parts In-Stock

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$24.000

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$24.000

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Native Components

USA . 601 parts In-Stock

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$1,250.550

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$1,225.539

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$1,213.034

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$1,200.528

601

$1,250.550

$1,225.539

$1,213.034

$1,200.528

Northwest PG Solutions

USA . 2,112 parts In-Stock

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$1,375.605

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$1,375.605

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iodParts Technologies Inc.

India . 5,415 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 2,919 parts In-Stock

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Overview

Discover the unparalleled quality and precision of Texas Instruments with the ADS7850IRTET Analog-to-Digital Converter. This cutting-edge chip carrier boasts a very thin profile and low linearity error, making it ideal for automotive applications and beyond. With a rapid conversion time of just 0.59 microseconds and a sample rate of 0.75 MHz, this device delivers unmatched performance. Experience the value and reliability that only Texas Instruments can offer, and revolutionize your designs with the ADS7850IRTET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more versatile input options and potentially more complex data acquisition.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto circuit boards, saving space and simplifying assembly processes.

No. of Bits: 14

With 14 bits, this ADC can provide high resolution and accuracy in converting analog signals to digital, suitable for precise measurements.

Maximum Linearity Error (EL): 0.0092 %

The low linearity error ensures that the converted digital values closely match the input analog signals, leading to accurate data conversion.

Minimum Supply Voltage: 1.65 V

Operating at a low minimum supply voltage allows for flexibility in power supply options and can be suitable for low-power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this ADC can maintain performance in harsh or high-temperature environments, making it suitable for industrial or automotive use.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides good conductivity, corrosion resistance, and solderability for reliable connections.

Maximum Conversion Time: 0.59 us

The fast conversion time allows for swift data acquisition and processing, making this ADC suitable for applications requiring real-time measurement.

Sample Rate: 0.75 MHz

With a high sample rate, this ADC can capture and convert analog signals quickly, making it suitable for applications that require fast data acquisition.

Technical Specifications

Analog-to-Digital Converters ADS7850IRTET attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0092 %

Sample Rate:

750 kHz

Hold Mode:

Sample

Maximum Conversion Time:

590 ns

Electrical Specifications

Minimum Analog Input Voltage:

-2.25 V

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

1.65 V

Maximum Supply Current:

9 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Trade Compliance

ADS7850IRTET Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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