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ADS7841ESG4

Texas Instruments

ADS7841ESG4 by Texas Instruments

The Texas Instruments ADS7841ESG4 is a 12-bit ADC with 4 analog input channels, operating at a sample rate of 0.2 MHz. It features a max linearity error of 0.0488%, suitable for automotive applications due to its temperature grade and small form factor. With a conversion time of 3.75 us, it offers precise digital conversion in compact designs.

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4

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1k+

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Digiode

USA . 3,519 parts In-Stock

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Vyrian

USA . 2,623 parts In-Stock

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VNN

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Nova Conductors

Japan . 300 parts In-Stock

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AZTECH Wire

Italy . 300 parts In-Stock

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$4.931

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$4.931

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One Stop Electronics

USA . 428 parts In-Stock

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$6.000

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Corohmni

South Africa . 51 parts In-Stock

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Semicontronic

India . 952 parts In-Stock

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$23.000

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$22.425

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$22.310

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$23.000

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Parana Technologies

USA . 937 parts In-Stock

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$24.511

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$25.177

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DigiPath Technology Company

USA . 371 parts In-Stock

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$26.990

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ChromeModa Solutions

Germany . 4,273 parts In-Stock

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IDEA Electronic Components Group

UK . 1,807 parts In-Stock

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Ampacity Inc.

Singapore . 494 parts In-Stock

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Microchip USA

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Perfect Parts

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Bastille Electronics

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Overview

Discover the unparalleled precision and reliability of the ADS7841ESG4 by Texas Instruments, a leading manufacturer in Analog-to-Digital Converters. With its compact size and advanced technology, this product is perfect for a wide range of applications in automotive systems, industrial automation, and more. Experience seamless conversion with a quick 3.75 us maximum conversion time and exceptional linearity error of just 0.0488%. Trust Texas Instruments to deliver exceptional quality and performance, providing you with unmatched value and benefits for all your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring long-lasting performance.

No. of Analog In Channels: 4

Having 4 analog input channels allows for versatile and flexible input options, making the product suitable for a variety of applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of handling and integration into standardized designs.

No. of Bits: 12

With 12 bits resolution, the product offers high accuracy and precision in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0488 %

The low linearity error ensures that the converted digital output closely corresponds to the input analog signal, maintaining accuracy.

Power Supplies (V): 2.7/5

The product can operate on a wide range of power supply voltages, providing flexibility in different system configurations.

No. of Terminals: 16

Having 16 terminals allows for easy connectivity and integration with other components, enhancing the product's usability.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style enables compact design layouts and efficient use of space.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement allows the product to operate in power-constrained environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliability and performance in extreme temperature conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the product suitable for use in harsh environments and varied temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel, palladium, and gold provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Having dual terminal positions allows for ease of installation and flexible mounting options.

Maximum Conversion Time: 3.75 us

The fast conversion time enables quick processing of analog signals, making the product suitable for real-time applications.

Maximum Seated Height: 1.75 mm

The low seated height profile facilitates compact designs and minimizes board space requirements.

Width: 3.9 mm

The narrow width of the product allows for space-efficient placement on circuit boards and compact system designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during assembly processes.

Length: 4.9 mm

The compact length of the product enables flexible placement within constrained spaces without compromising performance.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures the product's reliability and performance in automotive applications.

Maximum Analog Input Voltage: 5.25 V

The high maximum analog input voltage tolerance allows for compatibility with a wide range of input signal levels.

Sample Rate: 0.2 MHz

With a high sample rate of 0.2 MHz, the product can accurately capture and process fast-changing input signals.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity for reliable performance.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder connections for robust performance.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation analog-to-digital conversion method offers high precision and efficiency in converting analog signals to digital data.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying integration into existing systems.

Output Bit Code: BINARY

The binary output bit code provides a straightforward and widely-compatible digital output format for easy data processing.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for close spacing of terminals on circuit boards, enabling high-density integration.

Minimum Analog Input Voltage: 0 V

The 0V minimum analog input voltage allows for accurate conversion of zero-level analog signals, ensuring precision in data capture.

Output Format: SERIAL

The serial output format enables efficient data transmission and compatibility with various digital communication protocols.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold capability ensures accurate and stable digitization of input signals for reliable data conversion.

Moisture Sensitivity Level (MSL): 2

With a low moisture sensitivity level of 2, the product is less prone to moisture-related damage during storage and handling.

Technical Specifications

Analog-to-Digital Converters ADS7841ESG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

200 kHz

Hold Mode:

Sample

Maximum Conversion Time:

3.75 µs

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

2.7 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

16

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP16,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G16

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7841ESG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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