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ADS7832BP

Texas Instruments

ADS7832BP by Texas Instruments

Texas Instruments ADS7832BP is a 12-bit ADC with 4 analog channels, 0.0183% linearity error, and 0.117 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact IN-LINE package. Operating from -40 to 85°C, it offers high accuracy and fast conversion times.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 4,974 parts In-Stock

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Digiode

USA . 4,048 parts In-Stock

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VRG Components

USA . 10 parts In-Stock

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ECAB

Sweden . 10 parts In-Stock

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Component Electronics Inc.

Canada . 3 parts In-Stock

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GES GmbH

Germany . 1 parts In-Stock

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AZTECH Wire

Italy . 4,974 parts In-Stock

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$6.530

100+ parts

$6.270

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$6.150

10k+ parts

$6.020

4,974

$6.530

$6.270

$6.150

$6.020

Parana Technologies

USA . 1,762 parts In-Stock

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$8.863

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$9.546

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DigiPath Technology Company

USA . 928 parts In-Stock

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$9.759

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$8.978

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928

$9.759

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ChromeModa Solutions

Germany . 2,423 parts In-Stock

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$9.958

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$8.166

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$9.958

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IDEA Electronic Components Group

UK . 1,310 parts In-Stock

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$9.958

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$9.460

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$8.962

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One Stop Electronics

USA . 1,696 parts In-Stock

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$28.000

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Kepictronics

USA . 8,000 parts In-Stock

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Perfect Parts

USA . 6,119 parts In-Stock

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Corphita

USA . 3,732 parts In-Stock

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Northwest PG Solutions

USA . 2,066 parts In-Stock

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Native Components

USA . 463 parts In-Stock

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Microchip USA

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Overview

Enhance your analog-to-digital conversion experience with the ADS7832BP by Texas Instruments. This top-of-the-line converter boasts exceptional quality and precision, making it a reliable choice for a wide range of applications. With its 12-bit resolution and low linearity error, this converter delivers accurate results every time. Whether you're working in industrial automation or consumer electronics, the ADS7832BP offers unmatched value, benefits, and advantages that will elevate your projects to new heights. Trust Texas Instruments to provide you with the best-in-class solutions for all your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the converter, ensuring long-term reliability.

No. of Analog In Channels: 4

Having multiple analog input channels allows for greater flexibility in connecting various input sources, making the converter suitable for a wider range of applications.

No. of Bits: 12

The 12-bit resolution provides high accuracy in converting analog signals to digital, resulting in precise measurement and control.

Power Supplies (V): 3.3/5

The compatibility with 3.3V and 5V power supplies makes this converter versatile and suitable for integration into different types of systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the converter to function reliably in various environmental conditions, making it suitable for industrial applications.

Technology: CMOS

The CMOS technology used in this converter ensures low power consumption and high noise immunity, making it efficient and reliable in operation.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation type of analog-to-digital conversion provides fast and accurate results, making this converter suitable for real-time data acquisition and processing.

Technical Specifications

Analog-to-Digital Converters ADS7832BP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0183 %

Sample Rate:

117 kHz

Hold Mode:

Sample

Maximum Conversion Time:

8.5 µs

Electrical Specifications

Power Supplies:

3.3/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3.3 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Surface Mount:

No

Width:

0.601 in (15.26 mm)

Length:

1.472 in (37.4 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

In-Line

Package Shape:

Package Equivalence Code:

DIP28,.6

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-PDIP-T28

Qualified:

No

Trade Compliance

ADS7832BP Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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