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ADS7823EB/250G4

Texas Instruments

ADS7823EB/250G4 by Texas Instruments

Texas Instruments ADS7823EB/250G4 is a 12-bit ADC with 0.0244% linearity error, 2.7/5V power supplies, and 0.05 MHz sample rate. Ideal for industrial applications due to its small size, CMOS technology, and serial output format.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,817 parts In-Stock

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6,817

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VNN

France . 443 parts In-Stock

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443

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Digiode

USA . 396 parts In-Stock

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396

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 1,300 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 604 parts In-Stock

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$17.671

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Parana Technologies

USA . 1,857 parts In-Stock

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$22.098

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$22.696

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$22.098

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DigiPath Technology Company

USA . 257 parts In-Stock

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$24.332

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$22.386

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257

$24.332

$22.386

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IDEA Electronic Components Group

UK . 1,222 parts In-Stock

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$24.829

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$23.588

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$22.346

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1,222

$24.829

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ChromeModa Solutions

Germany . 6 parts In-Stock

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$24.829

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$20.360

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$24.829

$20.360

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Corphita

USA . 1,519 parts In-Stock

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Microchip USA

USA . 1,272 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Experience the unparalleled precision and reliability of the Texas Instruments ADS7823EB/250G4 Analog-to-Digital Converter. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers a product that exceeds expectations in various applications. From industrial automation to consumer electronics, this converter offers seamless integration, exceptional accuracy, and high performance. Upgrade your systems with the ADS7823EB/250G4 and unlock a world of possibilities with its unmatched value and benefits. Elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product in various conditions.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square package shape helps in optimizing space on the circuit board, making it suitable for compact designs.

No. of Bits: 12

With 12 bits, this product offers high resolution and accurate conversion of analog signals, ideal for precise measurements.

Maximum Linearity Error (EL): 0.0244 %

The low linearity error ensures consistent and reliable performance in converting analog signals to digital data.

Power Supplies (V): 2.7/5

The flexibility in power supply options makes this product versatile and compatible with various system requirements.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options for interfacing with external components, enhancing the product's functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and slim package style makes this product suitable for space-constrained applications without compromising performance.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows for reliable operation in harsh environments or industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product remains functional even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of multiple high-quality finishes on the terminals improves conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position enhances connection stability and reduces the risk of signal loss, making the product more robust.

Maximum Seated Height: 1.1 mm

The low seated height of the package allows for a compact design, ideal for applications with space constraints.

Width: 3 mm

The compact width of the product makes it suitable for applications where board space is limited, without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required for peak reflow temperature ensures quick and efficient assembly during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the product can withstand the rigors of the assembly process without damage.

Length: 3 mm

The short length of the product helps in optimizing board space, making it ideal for compact and densely populated circuit layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding environments with wide temperature fluctuations.

Maximum Analog Input Voltage: 5.25 V

The high maximum analog input voltage range allows for processing a wide range of analog signals without risking damage to the converter.

Sample Rate: 0.05 MHz

The high sample rate enables fast and accurate conversion of analog signals into digital data, suitable for applications requiring real-time data processing.

Technology: CMOS

The CMOS technology used in the product ensures low power consumption and high-speed operation, making it energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy and secure soldering onto the circuit board, ensuring a reliable electrical connection.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high accuracy and speed in converting analog signals, suitable for precision measurement applications.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage requirement offers compatibility with standard power sources, making it easy to integrate into existing systems.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and interpretation, making it suitable for digital signal processing applications.

Terminal Pitch: 0.65 mm

The small terminal pitch provides high-density integration capabilities, enabling compact designs without sacrificing connectivity options.

Minimum Analog Input Voltage: 0 V

The low minimum analog input voltage range allows for processing even the smallest analog signals accurately, suitable for a wide range of applications.

Output Format: SERIAL

The serial output format simplifies data transmission and integration with other digital systems, making it versatile and easy to interface with.

Sample and Hold/Track and Hold: SAMPLE

The sample and hold feature ensures accurate and stable signal conversion by capturing and processing analog input signals at precise moments.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates the product can withstand moderate moisture exposure during storage or handling, ensuring long-term reliability in various environments.

Technical Specifications

Analog-to-Digital Converters ADS7823EB/250G4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0244 %

Sample Rate:

50 kHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

2.7/5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

2.7 V

Minimum Supply Voltage:

4.75 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP8,.19

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS7823EB/250G4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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