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ADS6423IRGCR

Texas Instruments

ADS6423IRGCR by Texas Instruments

The Texas Instruments ADS6423IRGCR is a 12-bit ADC with 4 analog input channels, operating at a sample rate of 80 MHz. It features a max linearity error of 0.0488% and supports a supply voltage of 3.3V. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,981 parts In-Stock

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4,981

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Vyrian

USA . 2,818 parts In-Stock

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2,818

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Distributors (Availability)

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Native Components

USA . 961 parts In-Stock

1+ parts

$1.585

100+ parts

-

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961

$1.585

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Northwest PG Solutions

USA . 2,000 parts In-Stock

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$1.744

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2,000

$1.744

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One Stop Electronics

USA . 783 parts In-Stock

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$12.000

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783

$12.000

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Parana Technologies

USA . 468 parts In-Stock

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$14.033

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$14.501

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468

$14.033

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$14.501

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DigiPath Technology Company

USA . 1,304 parts In-Stock

1+ parts

$15.452

100+ parts

$14.216

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1,304

$15.452

$14.216

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ChromeModa Solutions

Germany . 5,263 parts In-Stock

1+ parts

$15.767

100+ parts

$12.929

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5,263

$15.767

$12.929

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IDEA Electronic Components Group

UK . 1,539 parts In-Stock

1+ parts

$15.767

100+ parts

$14.979

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$14.190

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1,539

$15.767

$14.979

$14.190

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AZTECH Wire

Italy . 409 parts In-Stock

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$17.972

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409

$17.972

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 4,705 parts In-Stock

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Microchip USA

USA . 1,023 parts In-Stock

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Overview

Discover the unparalleled precision and reliability of the ADS6423IRGCR by Texas Instruments, a leading manufacturer in the field of Analog-to-Digital Converters. With its advanced technology and industrial-grade design, this innovative chip carrier offers 4 analog input channels and a high sample rate of 80 MHz, making it ideal for a wide range of applications. Experience the benefits of its superior performance and efficiency, delivering accurate results with a maximum linearity error of just 0.0488%. Elevate your projects to new heights with the ADS6423IRGCR, providing unmatched value and quality for all your analog-to-digital conversion needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides good durability and protection for the internal components of the ADC.

No. of Analog In Channels: 4

Having 4 analog input channels allows for multiple signals to be efficiently converted simultaneously.

Surface Mount: YES

Surface mount capability makes for easy and efficient PCB assembly.

No. of Bits: 12

12-bit resolution results in finer and more accurate conversion of analog signals.

Maximum Operating Temperature: 85 °C

High operating temperature range makes this ADC suitable for industrial applications where it may be subjected to varying environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance.

Sample Rate: 80 MHz

High sample rate of 80 MHz ensures fast and efficient conversion of analog signals.

Technical Specifications

Analog-to-Digital Converters ADS6423IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

80 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6423IRGCR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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