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ADS62P23IRGC25

Texas Instruments

ADS62P23IRGC25 by Texas Instruments

Texas Instruments ADS62P23IRGC25 is a 12-bit ADC with 2 analog in channels, 80 MHz sample rate, and 0.0488% linearity error. Ideal for industrial applications requiring high-speed data conversion in a compact chip carrier package. Operating temperature range from -40 to 85°C makes it suitable for various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,981 parts In-Stock

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Digiode

USA . 1,074 parts In-Stock

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1,074

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Distributors (Availability)

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Native Components

USA . 667 parts In-Stock

1+ parts

$1.585

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667

$1.585

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Northwest PG Solutions

USA . 767 parts In-Stock

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$1.744

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767

$1.744

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AZTECH Wire

Italy . 212 parts In-Stock

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$13.545

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$13.545

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Parana Technologies

USA . 1,963 parts In-Stock

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$24.817

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$25.495

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1,963

$24.817

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$25.495

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One Stop Electronics

USA . 528 parts In-Stock

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$27.000

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528

$27.000

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DigiPath Technology Company

USA . 1,073 parts In-Stock

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$27.326

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$25.140

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$27.326

$25.140

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IDEA Electronic Components Group

UK . 406 parts In-Stock

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$27.884

100+ parts

$26.490

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$25.096

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406

$27.884

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ChromeModa Solutions

Germany . 305 parts In-Stock

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$27.884

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$22.865

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305

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Corphita

USA . 4,957 parts In-Stock

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Microchip USA

USA . 2,292 parts In-Stock

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Overview

Unleash the power of precision and performance with the ADS62P23IRGC25 Analog-to-Digital Converter from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for a range of applications, this converter offers unparalleled accuracy and speed, making it a must-have for any project requiring high-quality analog-to-digital conversion. Experience the value and benefits of the ADS62P23IRGC25 and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Analog In Channels: 2

Allows for multiple analog input signals to be converted simultaneously, increasing flexibility and efficiency.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Helps conserve space on the circuit board, making it suitable for compact electronic devices.

No. of Bits: 12

Delivers high-resolution digital conversion, resulting in more accurate and precise output data.

Maximum Linearity Error (EL): 0.0488 %

Ensures minimal deviation from the ideal output values, enhancing the overall accuracy of the conversion process.

Power Supplies (V): 1.8/3.3,3.3

Supports a wide range of power supply voltages, allowing compatibility with various electronic systems.

No. of Terminals: 64

Provides ample connectivity options, making it suitable for complex circuit designs.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers flexibility in terms of mounting options, catering to different application requirements.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high-temperature environments, improving reliability.

Technical Specifications

Analog-to-Digital Converters ADS62P23IRGC25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0488 %

Sample Rate:

80 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8/3.3,3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS62P23IRGC25 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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