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ADS6225IRGZR

Texas Instruments

ADS6225IRGZR by Texas Instruments

The Texas Instruments ADS6225IRGZR is a 12-bit ADC with 2 analog input channels, operating at a sample rate of 125 MHz. It has a max linearity error of 0.061% and supports binary, offset binary, and 2's complement output formats. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,528 parts In-Stock

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5,528

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Digiode

USA . 1,307 parts In-Stock

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1,307

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Distributors (Availability)

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Northwest PG Solutions

USA . 322 parts In-Stock

1+ parts

$2.794

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322

$2.794

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AZTECH Wire

Italy . 226 parts In-Stock

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$9.674

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226

$9.674

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Parana Technologies

USA . 585 parts In-Stock

1+ parts

$24.086

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$24.738

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585

$24.086

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$24.738

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DigiPath Technology Company

USA . 1,900 parts In-Stock

1+ parts

$26.522

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$24.400

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1,900

$26.522

$24.400

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ChromeModa Solutions

Germany . 5,608 parts In-Stock

1+ parts

$27.063

100+ parts

$22.192

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5,608

$27.063

$22.192

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IDEA Electronic Components Group

UK . 1,651 parts In-Stock

1+ parts

$27.063

100+ parts

$25.710

1k+ parts

$24.357

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1,651

$27.063

$25.710

$24.357

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One Stop Electronics

USA . 854 parts In-Stock

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$32.000

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854

$32.000

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Component Stockers USA

USA . 454 parts In-Stock

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$99.990

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454

$99.990

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Microchip USA

USA . 2,979 parts In-Stock

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2,979

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Corphita

USA . 2,860 parts In-Stock

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Native Components

USA . 1,000 parts In-Stock

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$2.464

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1,000

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$2.464

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Overview

Unlock the power of precision with the ADS6225IRGZR by Texas Instruments. As a top-tier manufacturer in the industry, Texas Instruments delivers exceptional quality analog-to-digital converters like no other. This versatile device with 2 analog in channels and 12 bits ensures accurate data conversion for a wide range of applications. From industrial automation to medical equipment, the ADS6225IRGZR offers unparalleled value with its high performance and reliability. Trust Texas Instruments to provide cutting-edge technology that meets your needs with excellence. Elevate your projects with the ADS6225IRGZR today.

Feature Benefit Bullets

No. of Analog In Channels: 2

Having 2 analog input channels allows for more flexibility in capturing and processing multiple analog signals simultaneously.

No. of Bits: 12

With 12 bits resolution, this converter can provide a high level of detail and accuracy in converting analog signals to digital values.

Maximum Linearity Error (EL): 0.061 %

The low linearity error of 0.061% ensures minimal distortion in converting analog signals to digital, maintaining accuracy.

Sample Rate: 125 MHz

A high sample rate of 125 MHz allows for fast and efficient conversion of analog signals, suitable for applications requiring real-time data processing.

Technology: CMOS

Using CMOS technology provides low power consumption and high noise immunity, making the converter energy-efficient and reliable.

Maximum Analog Input Voltage: 2 V

The maximum analog input voltage of 2 V ensures compatibility with a wide range of analog signal sources.

Technical Specifications

Analog-to-Digital Converters ADS6225IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.061 %

Sample Rate:

125 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6225IRGZR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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