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ADS6224IRGZR

Texas Instruments

ADS6224IRGZR by Texas Instruments

The Texas Instruments ADS6224IRGZR is a 12-bit ADC with 2 analog in channels, operating at a sample rate of 105 MHz. It has a max linearity error of 0.0537% and supports binary, offset binary, and 2's complement binary output formats. Ideal for industrial applications requiring high-speed and accurate analog-to-digital conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,406 parts In-Stock

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Digiode

USA . 4,224 parts In-Stock

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4,224

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Distributors (Availability)

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AZTECH Wire

Italy . 195 parts In-Stock

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$19.605

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195

$19.605

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One Stop Electronics

USA . 659 parts In-Stock

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$21.000

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Parana Technologies

USA . 583 parts In-Stock

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$24.738

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$25.407

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$24.738

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DigiPath Technology Company

USA . 1,622 parts In-Stock

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$27.239

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$25.060

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$27.239

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ChromeModa Solutions

Germany . 4,980 parts In-Stock

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$27.795

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$22.792

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$27.795

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IDEA Electronic Components Group

UK . 134 parts In-Stock

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$27.795

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$26.405

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$25.016

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134

$27.795

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Component Stockers USA

USA . 291 parts In-Stock

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$99.990

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Corphita

USA . 1,896 parts In-Stock

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Microchip USA

USA . 1,773 parts In-Stock

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Northwest PG Solutions

USA . 1,323 parts In-Stock

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Native Components

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Overview

Experience unparalleled precision and performance with the Texas Instruments ADS6224IRGZR Analog-to-Digital Converter. Crafted with utmost quality and expertise, this cutting-edge converter offers seamless integration and exceptional accuracy in a wide range of industrial applications. With a maximum linearity error of just 0.0537%, you can trust in the reliability and efficiency of this product. Elevate your projects with the ADS6224IRGZR and unlock a world of possibilities with its advanced technology and innovative design. Trust Texas Instruments for superior solutions that deliver unmatched value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications without compromising on reliability.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple analog signals simultaneously.

Surface Mount: YES

Surface mount technology makes installation easier and more convenient, saving time and effort during the manufacturing process.

No. of Bits: 12

With a higher number of bits, this ADC can provide greater precision and accuracy in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.0537%

The low linearity error ensures that the digital output closely matches the input signal, leading to more accurate data conversion.

Power Supplies (V): 3.3

With a nominal supply voltage of 3.3V, this ADC can be easily integrated into existing systems and circuits without the need for additional power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes this ADC suitable for use in industrial environments where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this ADC efficient and reliable in various applications.

Technical Specifications

Analog-to-Digital Converters ADS6224IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary, 2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0537 %

Sample Rate:

105 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

3.3 V

Minimum Analog Input Voltage:

-2 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6224IRGZR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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