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ADS6149IRGZ25

Texas Instruments

ADS6149IRGZ25 by Texas Instruments

Texas Instruments ADS6149IRGZ25 is a 14-bit ADC with 0.0305% EL, 250 MHz sample rate, and 3.3V supply voltage. Ideal for industrial applications requiring high-speed data conversion in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,360 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,360

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Digiode

USA . 2,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 798 parts In-Stock

1+ parts

$0.270

100+ parts

-

1k+ parts

-

10k+ parts

$0.259

798

$0.270

-

-

$0.259

Northwest PG Solutions

USA . 2,370 parts In-Stock

1+ parts

$0.297

100+ parts

-

1k+ parts

-

10k+ parts

$0.262

2,370

$0.297

-

-

$0.262

AZTECH Wire

Italy . 880 parts In-Stock

1+ parts

$9.910

100+ parts

-

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880

$9.910

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Parana Technologies

USA . 161 parts In-Stock

1+ parts

$16.754

100+ parts

-

1k+ parts

$17.007

10k+ parts

-

161

$16.754

-

$17.007

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DigiPath Technology Company

USA . 842 parts In-Stock

1+ parts

$18.448

100+ parts

-

1k+ parts

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10k+ parts

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842

$18.448

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ChromeModa Solutions

Germany . 2,371 parts In-Stock

1+ parts

$18.825

100+ parts

$15.436

1k+ parts

-

10k+ parts

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2,371

$18.825

$15.436

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IDEA Electronic Components Group

UK . 687 parts In-Stock

1+ parts

$18.825

100+ parts

$17.884

1k+ parts

$16.942

10k+ parts

-

687

$18.825

$17.884

$16.942

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One Stop Electronics

USA . 999 parts In-Stock

1+ parts

$24.000

100+ parts

-

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999

$24.000

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Corphita

USA . 3,068 parts In-Stock

1+ parts

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3,068

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Microchip USA

USA . 1,753 parts In-Stock

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1,753

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Overview

Experience unparalleled precision and efficiency with the ADS6149IRGZ25 by Texas Instruments, a leading manufacturer of Analog-to-Digital Converters. This innovative product offers high-quality performance and reliability in various industrial applications. With its superior 14-bit resolution and low linearity error, this converter ensures accurate data conversion for your projects. Benefit from its wide operating temperature range, multiple power supply options, and compact design. Elevate your systems with the value and advantages that only Texas Instruments can deliver. Choose the ADS6149IRGZ25 for exceptional results every time.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy assembly onto circuit boards, making it suitable for automated manufacturing processes.

No. of Bits: 14

Higher number of bits provides greater resolution and accuracy in converting analog signals to digital data.

Power Supplies (V): 1.8,3.3

Support for multiple power supply options provides flexibility in various applications and operating conditions.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in harsh environmental conditions.

Sample Rate: 250 MHz

High sample rate enables fast and accurate conversion of analog signals to digital data, suitable for high-speed applications.

Technical Specifications

Analog-to-Digital Converters ADS6149IRGZ25 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial, Parallel, Word

Maximum Linearity Error (EL):

0.0305 %

Sample Rate:

250 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS6149IRGZ25 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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