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ADS54J66IRMP

Texas Instruments

ADS54J66IRMP by Texas Instruments

Texas Instruments ADS54J66IRMP is a 14-bit ADC with 4 analog in channels, 500 MHz sample rate, and serial output format. Ideal for industrial applications requiring high-speed data conversion with a temperature range of -45 to 85°C.

Median Price

$561.600

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$115.640

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-

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1

$115.640

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Texas Instruments

USA . 2,896 parts In-Stock

1+ parts

$557.960

100+ parts

$505.050

1k+ parts

$481.000

10k+ parts

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2,896

$557.960

$505.050

$481.000

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Chip1Stop

Japan . 118 parts In-Stock

1+ parts

$561.600

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118

$561.600

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Verical

USA . 1 parts In-Stock

1+ parts

$646.543

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1

$646.543

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DigiKey

USA . 109 parts In-Stock

1+ parts

$1,020.680

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109

$1,020.680

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,917 parts In-Stock

1+ parts

$109.858

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3,917

$109.858

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TME

Poland . 11 parts In-Stock

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$1,015.435

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11

$1,015.435

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Vyrian

USA . 4,725 parts In-Stock

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4,725

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Carlin Systems, Inc.

USA . 46 parts In-Stock

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46

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 566 parts In-Stock

1+ parts

$24.199

100+ parts

$2,247.254

1k+ parts

$21.779

10k+ parts

-

566

$24.199

$2,247.254

$21.779

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DigiPath Technology Company

USA . 1,359 parts In-Stock

1+ parts

$26.646

100+ parts

$24.515

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1,359

$26.646

$24.515

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ChromeModa Solutions

Germany . 743 parts In-Stock

1+ parts

$27.190

100+ parts

$22.296

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743

$27.190

$22.296

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IDEA Electronic Components Group

UK . 45 parts In-Stock

1+ parts

$27.190

100+ parts

$25.830

1k+ parts

$24.471

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45

$27.190

$25.830

$24.471

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Ampacity Inc.

Singapore . 235 parts In-Stock

1+ parts

$98.290

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235

$98.290

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Corphita

USA . 4,914 parts In-Stock

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$104.076

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4,914

$104.076

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Lixinc

USA . 15,333 parts In-Stock

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15,333

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Authorized Procurement Solutions

USA . 3,600 parts In-Stock

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3,600

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Native Components

USA . 920 parts In-Stock

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920

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GreenTree Electronics

Israel . 168 parts In-Stock

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168

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Northwest PG Solutions

USA . 38 parts In-Stock

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38

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Overview

Unlock the power of precision with the ADS54J66IRMP by Texas Instruments. As a leader in analog-to-digital converters, Texas Instruments delivers unmatched quality and reliability. This versatile chip is perfect for applications requiring high-speed data conversion, offering 4 analog input channels and a blazing fast 500 MHz sample rate. With a compact square package design and industrial temperature grade, this ADC is the ideal choice for demanding industrial and communication applications. Experience superior performance and value with the ADS54J66IRMP - the ultimate solution for your data conversion needs.

Feature Benefit Bullets

No. of Analog In Channels: 4

Having 4 analog input channels allows for the simultaneous conversion of multiple analog signals, making this product suitable for applications requiring multiple sensors or inputs.

Surface Mount: YES

The surface mount option enables easy and efficient PCB assembly, saving time and providing a compact and reliable solution for system integration.

No. of Bits: 14

With 14 bits of resolution, this ADC can provide high precision and accuracy in converting analog signals to digital data, making it suitable for applications that require precise measurements.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier packaging with heat sink/slug and very thin profile design helps in efficient heat dissipation and space-saving integration in compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this ADC to function reliably in industrial environments with elevated temperatures, ensuring consistent performance under challenging conditions.

Minimum Operating Temperature: -45 °C

The low minimum operating temperature of -45°C enables this ADC to operate in cold environments or during cold start conditions, providing versatility in various operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and durability, ensuring reliable connections and long-term performance of the ADC.

Width: 10 mm

With a width of 10 mm, this ADC has a compact form factor that facilitates easy integration into space-constrained electronic systems.

Output Format: SERIAL

The serial output format simplifies data transfer and communication with other digital devices, making it compatible with a wide range of microcontrollers and processors.

Technical Specifications

Analog-to-Digital Converters ADS54J66IRMP attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

4

No. of Functions:

1

No. of Bits:

14

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Sample Rate:

500 MHz

Hold Mode:

Sample

Electrical Specifications

Minimum Analog Input Voltage:

-1.9 V

Maximum Analog Input Voltage:

1.9 V

Nominal Supply Voltage:

1.9 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-45 °C (-49 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

72

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.035 in (0.9 mm)

Packaging

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e4

Trade Compliance

ADS54J66IRMP Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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