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ADS5121IZHK

Texas Instruments

ADS5121IZHK by Texas Instruments

Texas Instruments ADS5121IZHK ADC features 10-bit resolution, 8 analog inputs, and 40 MHz sample rate. Ideal for industrial applications, it operates b/w -40 to 85°C with a low profile grid array package. With a max conversion time of 0.2 us and offset binary output format, it offers precise analog-to-digital conversion.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,552 parts In-Stock

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Digiode

USA . 2,061 parts In-Stock

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2,061

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LWI Electronics Inc

India . 177 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 398 parts In-Stock

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$0.564

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398

$0.564

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Northwest PG Solutions

USA . 2,354 parts In-Stock

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$0.620

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$0.620

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One Stop Electronics

USA . 419 parts In-Stock

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$1.000

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AZTECH Wire

Italy . 818 parts In-Stock

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$6.077

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818

$6.077

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Parana Technologies

USA . 68 parts In-Stock

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$7.997

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$742.610

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$7.197

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68

$7.997

$742.610

$7.197

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DigiPath Technology Company

USA . 1,206 parts In-Stock

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$8.805

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$8.101

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ChromeModa Solutions

Germany . 2,111 parts In-Stock

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$8.985

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$7.368

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$8.985

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IDEA Electronic Components Group

UK . 2,051 parts In-Stock

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$8.985

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$8.536

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$8.086

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2,051

$8.985

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$8.086

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Vigor

Singapore . 870 parts In-Stock

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$62.880

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$62.880

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A-Z Elektronik GmbH

Germany . 7,001 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,667 parts In-Stock

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Corphita

USA . 4,474 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Microchip USA

USA . 485 parts In-Stock

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Infinite Electronics LLP (Excess)

. 72 parts In-Stock

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Overview

Unleash the power of precision with the ADS5121IZHK Analog-to-Digital Converter by Texas Instruments. Renowned for their quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds expectations. This versatile converter features 8 analog input channels, a fast sampling rate of 40 MHz, and a compact square package design. Perfect for industrial applications, this ADC offers unmatched performance with a maximum linearity error of only 0.1465%. Elevate your projects with the ADS5121IZHK and experience unparalleled accuracy and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

No. of Analog In Channels: 8

Having 8 analog input channels allows for multiple signals to be processed simultaneously, increasing efficiency.

Surface Mount: YES

Surface mount technology makes the product easy to integrate into circuit boards, saving space and simplifying production.

No. of Bits: 10

With a higher number of bits, this ADC can provide more accurate digital representations of analog signals.

Maximum Linearity Error (EL): 0.1465 %

Low linearity error ensures accurate conversion of analog signals to digital, improving overall performance.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages allows for flexibility in system design and integration.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC is suitable for industrial applications that may experience elevated temperatures.

Sample Rate: 40 MHz

A high sample rate allows for fast and efficient conversion of analog signals, making this ADC suitable for high-speed applications.

Technical Specifications

Analog-to-Digital Converters ADS5121IZHK attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.1465 %

Sample Rate:

40 MHz

Hold Mode:

Track

Maximum Conversion Time:

200 ns

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

760 mV

Maximum Analog Input Voltage:

1.42 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

255 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

257

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.63 in (16 mm)

Length:

0.63 in (16 mm)

Maximum Seated Height:

0.055 in (1.4 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA257,19X19,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B257

Qualified:

No

JESD-609 Code:

e1

Trade Compliance

ADS5121IZHK Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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