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ADS42LB49IRGCR

Texas Instruments

ADS42LB49IRGCR by Texas Instruments

Texas Instruments ADS42LB49IRGCR is a 14-bit ADC with 2 analog in channels, 250 MHz sample rate, and 0.0183% linearity error. Ideal for industrial applications, it operates b/w -40 to 85°C with a supply voltage of 1.8V or 3.3V. Package style includes chip carrier and very thin profile for compact designs.

Median Price

$140.360

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,585 parts In-Stock

1+ parts

$140.360

100+ parts

$127.050

1k+ parts

$121.000

10k+ parts

-

5,585

$140.360

$127.050

$121.000

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,060 parts In-Stock

1+ parts

$133.342

100+ parts

-

1k+ parts

-

10k+ parts

-

1,060

$133.342

-

-

-

Vyrian

USA . 7,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,716

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,748 parts In-Stock

1+ parts

$2.530

100+ parts

-

1k+ parts

-

10k+ parts

-

1,748

$2.530

-

-

-

Parana Technologies

USA . 1,205 parts In-Stock

1+ parts

$8.810

100+ parts

-

1k+ parts

$9.494

10k+ parts

-

1,205

$8.810

-

$9.494

-

IDEA Electronic Components Group

UK . 1,859 parts In-Stock

1+ parts

$9.899

100+ parts

$9.404

1k+ parts

$8.909

10k+ parts

-

1,859

$9.899

$9.404

$8.909

-

ChromeModa Solutions

Germany . 132 parts In-Stock

1+ parts

$9.899

100+ parts

$8.117

1k+ parts

-

10k+ parts

-

132

$9.899

$8.117

-

-

AZTECH Wire

Italy . 141 parts In-Stock

1+ parts

$20.790

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$20.790

-

-

-

Corphita

USA . 111 parts In-Stock

1+ parts

$126.324

100+ parts

-

1k+ parts

-

10k+ parts

-

111

$126.324

-

-

-

Microchip USA

USA . 1,877 parts In-Stock

1+ parts

$158.810

100+ parts

$154.580

1k+ parts

$152.460

10k+ parts

$150.340

1,877

$158.810

$154.580

$152.460

$150.340

Lixinc

USA . 16,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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16,983

-

-

-

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DigiPath Technology Company

USA . 1,564 parts In-Stock

1+ parts

-

100+ parts

$8.925

1k+ parts

-

10k+ parts

-

1,564

-

$8.925

-

-

Kepictronics

USA . 820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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820

-

-

-

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Native Components

USA . 553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.231

10k+ parts

-

553

-

-

$2.231

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Overview

Elevate your analog-to-digital conversion with the ADS42LB49IRGCR by Texas Instruments, a leading manufacturer known for top-quality components. This versatile converter offers exceptional precision and reliability in a compact package, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this ADC delivers unmatched performance with its high sample rate and low power consumption. Experience the value and benefits of Texas Instruments' cutting-edge technology with the ADS42LB49IRGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for various applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for more flexibility in the types of signals that can be converted.

Surface Mount: YES

Surface mounting capability makes integration into electronic circuits easier and more efficient.

No. of Bits: 14

With 14 bits, this ADC can provide high resolution and accuracy in conversion.

Maximum Linearity Error (EL): 0.0183%

Low linearity error ensures accurate conversion of analog signals to digital with minimal distortion.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages offers flexibility in different operating environments.

No. of Terminals: 64

Having 64 terminals enables the connection to various components and interfaces for data transfer.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide options for different installation and thermal management requirements.

Maximum Operating Temperature: 85 °C

Wide temperature range supports operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

Operational at low temperatures makes it suitable for use in cold environments as well.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides corrosion resistance and ensures stable electrical connections over time.

Terminal Position: QUAD

Quad terminal positioning facilitates easier and more organized connection to other components.

Maximum Seated Height: 1 mm

Low profile design allows for compact assembly and space-saving in device applications.

Width: 9 mm

Compact width makes it suitable for applications where space is a constraint.

Maximum Time At Peak Reflow Temperature (s): 30

Maintaining peak reflow temperature for a specific time ensures proper soldering and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure soldering and longevity of connections.

Length: 9 mm

Compact length makes it suitable for applications with limited space availability.

Temperature Grade: INDUSTRIAL

Industrial temperature rating ensures reliable performance in harsh operating conditions.

Maximum Analog Input Voltage: 2.5 V

Support for high analog input voltage range allows for a wide variety of signal sources.

Sample Rate: 250 MHz

High sample rate enables fast and accurate conversion of analog signals to digital data.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is safer for handling.

Maximum Supply Current: 182 mA

Low maximum supply current consumption helps in reducing power requirements and energy efficiency.

Converter Type: ADC, PROPRIETARY METHOD

Proprietary method of analog to digital conversion ensures unique performance and features tailored to specific applications.

Nominal Supply Voltage: 1.8 V

Support for nominal supply voltage of 1.8V offers compatibility with a wide range of systems and power sources.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Multiple output bit codes provide flexibility in data representation and compatibility with different systems.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for dense mounting and space-saving on circuit boards.

Minimum Analog Input Voltage: -2.5 V

Support for negative analog input voltage range enables conversion of bipolar signals with ease.

Output Format: SERIAL

Serial output format enables easy interfacing with microcontrollers and digital systems.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold feature ensures accurate conversion of analog signals at specific time points.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for use in controlled humidity environments.

Technical Specifications

Analog-to-Digital Converters ADS42LB49IRGCR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.0183 %

Sample Rate:

250 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

1.8,3.3 V

Minimum Analog Input Voltage:

-2.5 V

Maximum Analog Input Voltage:

2.5 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Current:

182 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS42LB49IRGCR Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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