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ADS2806Y/250

Texas Instruments

ADS2806Y/250 by Texas Instruments

Texas Instruments ADS2806Y/250 ADC features 2 channels, 12-bit resolution, and 32 MHz sample rate. Ideal for industrial applications with -40 to 85°C operating range. Package: PLASTIC/EPOXY, Surface Mount, Quad Terminal Position.

Median Price

$34.322

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 253 parts In-Stock

1+ parts

$6.388

100+ parts

$6.083

1k+ parts

$5.981

10k+ parts

-

253

$6.388

$6.083

$5.981

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Chip1Stop

Japan . 253 parts In-Stock

1+ parts

$27.900

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-

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253

$27.900

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Texas Instruments

USA . 6,869 parts In-Stock

1+ parts

$35.395

100+ parts

$31.462

1k+ parts

$23.134

10k+ parts

-

6,869

$35.395

$31.462

$23.134

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Mouser Electronics

USA . 43 parts In-Stock

1+ parts

$51.860

100+ parts

$37.780

1k+ parts

$36.560

10k+ parts

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43

$51.860

$37.780

$36.560

-

Rochester

USA . 2,375 parts In-Stock

1+ parts

-

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$33.250

1k+ parts

$29.750

10k+ parts

$28.000

2,375

-

$33.250

$29.750

$28.000

DigiKey

USA . 2,375 parts In-Stock

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2,375

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Verical

USA . 1,489 parts In-Stock

1+ parts

-

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$41.563

1k+ parts

$37.188

10k+ parts

$35.000

1,489

-

$41.563

$37.188

$35.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,680 parts In-Stock

1+ parts

$22.752

100+ parts

-

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1,680

$22.752

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-

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Vyrian

USA . 72 parts In-Stock

1+ parts

$23.950

100+ parts

-

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72

$23.950

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DigiKey Marketplace

USA . 2,375 parts In-Stock

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Freddi Giovanni

Italy . 250 parts In-Stock

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250

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Chip Stock

USA . 225 parts In-Stock

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225

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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Elcom Components

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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Native Components

USA . 807 parts In-Stock

1+ parts

$0.079

100+ parts

-

1k+ parts

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10k+ parts

$0.076

807

$0.079

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-

$0.076

Northwest PG Solutions

USA . 1,613 parts In-Stock

1+ parts

$0.087

100+ parts

-

1k+ parts

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10k+ parts

$0.077

1,613

$0.087

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-

$0.077

Parana Technologies

USA . 308 parts In-Stock

1+ parts

$7.009

100+ parts

-

1k+ parts

$7.568

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308

$7.009

-

$7.568

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ChromeModa Solutions

Germany . 2,649 parts In-Stock

1+ parts

$7.875

100+ parts

$6.458

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-

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2,649

$7.875

$6.458

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IDEA Electronic Components Group

UK . 471 parts In-Stock

1+ parts

$7.875

100+ parts

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$7.088

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471

$7.875

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$7.088

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Corphita

USA . 3,284 parts In-Stock

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$21.555

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3,284

$21.555

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QUARKTWIN TECHNOLOGY LTD

USA . 15,673 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,787 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,858 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 1,922 parts In-Stock

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Metaverse IC Inc.

Canada . 1,889 parts In-Stock

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Kepictronics

USA . 1,822 parts In-Stock

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DigiPath Technology Company

USA . 1,388 parts In-Stock

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$7.100

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$7.100

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Lixinc

USA . 792 parts In-Stock

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GreenTree Electronics

Israel . 214 parts In-Stock

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Overview

Elevate your analog-to-digital conversion experience with the ADS2806Y/250 by Texas Instruments. Crafted from high-quality materials and boasting advanced technology, this converter offers unparalleled precision and reliability. Ideal for a wide range of applications, this product delivers exceptional performance in industrial settings. Say goodbye to compromise and hello to superior quality with the ADS2806Y/250.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, ideal for portable or rugged applications.

No. of Analog In Channels: 2

Having 2 analog input channels allows for simultaneous measurement of two different signals, increasing versatility and efficiency.

Surface Mount: YES

The surface mount feature simplifies PCB assembly, saving time and making it easier to integrate into various electronic devices.

No. of Functions: 2

With 2 functions in one device, it provides cost savings and reduces the footprint on the PCB, making it space-efficient.

Package Shape: SQUARE

The square package shape ensures easy placement and alignment on the PCB, optimizing space utilization.

No. of Bits: 12

The 12-bit resolution provides high precision and accuracy in converting analog signals to digital, suitable for applications requiring fine measurements.

Maximum Linearity Error (EL): 0.0977 %

The low linearity error ensures that the digital output closely matches the input signal, guaranteeing accurate data conversion.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies the design and integration process, compatible with most electronic systems.

No. of Terminals: 64

The 64 terminals offer multiple connection points for a secure and reliable interface with the PCB, ensuring stable performance.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles provide flexibility in mounting options, heat dissipation, and compatibility with different PCB layouts.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the product suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the product to function reliably in extreme cold conditions, enhancing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity, corrosion resistance, and durability for long-term performance.

Terminal Position: QUAD

The quad terminal position simplifies the soldering process and enhances stability during PCB assembly, ensuring a secure connection.

Maximum Conversion Time: 100 us

The fast conversion time enables real-time data acquisition and processing, making the product ideal for time-sensitive applications.

Maximum Seated Height: 1.2 mm

The low seated height facilitates compact PCB design and reduces the overall profile of the device, ideal for space-constrained applications.

Width: 10 mm

The compact width dimension allows for efficient space utilization on the PCB, enabling the integration of multiple components in a limited area.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature reduces the risk of overheating during soldering, ensuring the reliability of the product over time.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process without compromising its performance or structural integrity.

Length: 10 mm

The compact length dimension allows for efficient board space utilization and easy integration into electronic systems with limited space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environments with temperature fluctuations, making it suitable for industrial applications.

Maximum Analog Input Voltage: 3 V

The high maximum analog input voltage range allows for flexibility in signal input levels, accommodating a wide range of analog signals.

Sample Rate: 32 MHz

The high sample rate allows for fast and accurate signal processing, making the product suitable for high-speed data acquisition applications.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast operation, enhancing the overall performance and efficiency of the product.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process, provides mechanical strength, and ensures a reliable electrical connection on the PCB.

Converter Type: ADC, PROPRIETARY METHOD

The proprietary ADC conversion method offers unique features and performance advantages, making the product stand out in terms of accuracy and efficiency.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying the integration process into existing electronic systems.

Output Bit Code: OFFSET BINARY

The offset binary output bit code provides flexibility in data encoding and processing, meeting the requirements of various applications.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting on the PCB, saving space and allowing for more compact electronic designs.

Minimum Analog Input Voltage: -3 V

The wide range of analog input voltage, including negative values, allows for versatile signal processing and compatibility with different input sources.

Output Format: PARALLEL, WORD

The parallel and word output formats provide flexibility in interfacing with other digital systems, making data transmission and processing more efficient.

Sample and Hold/Track and Hold: TRACK

The track and hold feature ensures accurate and stable analog-to-digital conversion by capturing and maintaining the input signal during the conversion process.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product has moderate sensitivity to moisture, ensuring reliable performance under normal operating conditions.

Technical Specifications

Analog-to-Digital Converters ADS2806Y/250 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

32 MHz

Hold Mode:

Track

Maximum Conversion Time:

100 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-3 V

Maximum Analog Input Voltage:

3 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP64,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G64

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS2806Y/250 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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