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ADS2806Y/1K5G4

Texas Instruments

ADS2806Y/1K5G4 by Texas Instruments

Texas Instruments ADS2806Y/1K5G4 is a 12-bit ADC with 0.0977% EL, 32 MHz sample rate, and 100 us conversion time. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,283 parts In-Stock

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6,283

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Digiode

USA . 2,130 parts In-Stock

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2,130

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Distributors (Availability)

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Parana Technologies

USA . 1,402 parts In-Stock

1+ parts

$4.745

100+ parts

-

1k+ parts

$5.245

10k+ parts

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1,402

$4.745

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$5.245

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ChromeModa Solutions

Germany . 5,985 parts In-Stock

1+ parts

$5.331

100+ parts

$4.371

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5,985

$5.331

$4.371

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IDEA Electronic Components Group

UK . 1,540 parts In-Stock

1+ parts

$5.331

100+ parts

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$4.798

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1,540

$5.331

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$4.798

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One Stop Electronics

USA . 1,277 parts In-Stock

1+ parts

$10.000

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1,277

$10.000

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AZTECH Wire

Italy . 648 parts In-Stock

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$19.518

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648

$19.518

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QUARKTWIN TECHNOLOGY LTD

USA . 12,943 parts In-Stock

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Northwest PG Solutions

USA . 1,586 parts In-Stock

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1,586

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DigiPath Technology Company

USA . 1,006 parts In-Stock

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$4.806

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1,006

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$4.806

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Native Components

USA . 985 parts In-Stock

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985

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Corphita

USA . 590 parts In-Stock

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590

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Microchip USA

USA . 482 parts In-Stock

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482

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Overview

Experience the unparalleled precision and reliability of Texas Instruments with the ADS2806Y/1K5G4 Analog-to-Digital Converter. This cutting-edge technology offers seamless conversion with exceptional accuracy, making it ideal for a wide range of applications. With a focus on quality and innovation, Texas Instruments delivers unmatched performance in a compact and versatile package. Trust in TI's expertise to bring value and efficiency to your projects with the ADS2806Y/1K5G4. Elevate your design capabilities and achieve superior results with this industry-leading solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good protection for the internal components of the Analog-to-Digital Converter.

Surface Mount: YES

Surface mount capability makes it easy to integrate this ADC into various electronic circuits and PCB designs.

No. of Functions: 2

Having 2 functions allows this ADC to perform multiple tasks efficiently, making it versatile for different applications.

Package Shape: SQUARE

Square package shape helps in optimizing space utilization on the PCB, especially in tight layouts.

No. of Bits: 12

The 12-bit resolution ensures accurate conversion of analog signals into digital data, suitable for demanding measurement applications.

Maximum Linearity Error (EL): 0.0977%

Low linearity error ensures high precision and accuracy in the conversion process, making this ADC reliable for critical applications.

Power Supplies (V): 5

Operating at 5V, this ADC can easily interface with standard electronic systems and circuits without requiring additional power conversion.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options and flexibility in designing circuits involving this ADC.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Multiple package styles offer compatibility with different PCB layouts and mounting options, catering to diverse design requirements.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows this ADC to function reliably in harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operational stability in both extreme cold and hot conditions, making this ADC suitable for various environments.

Terminal Position: QUAD

Quad terminal positioning simplifies the connection and integration of this ADC into circuit designs, facilitating ease of use.

Maximum Conversion Time: 100 us

Fast conversion time enables quick processing of analog signals, making this ADC ideal for applications requiring real-time data acquisition.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact and space-efficient PCB designs, important for applications with size constraints.

Width: 10 mm

Compact width dimensions contribute to the overall space-saving design of electronic circuits using this ADC.

Length: 10 mm

Short length dimensions help in accommodating this ADC in compact electronic devices and systems where space is limited.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in rugged industrial environments where temperature variations are common.

Maximum Analog Input Voltage: 3.25 V

High maximum analog input voltage allows for accurate conversion of a wide range of analog signals, enhancing the versatility of this ADC.

Sample Rate: 32 MHz

High sample rate enables rapid conversion of analog signals into digital data, suitable for applications requiring high-speed data acquisition.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation, making this ADC energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and mounting of this ADC onto PCBs, ensuring secure and reliable connections.

Converter Type: ADC, PROPRIETARY METHOD

Utilizing a proprietary conversion method enhances the performance and accuracy of this ADC, setting it apart from standard conversion techniques.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with common power sources and simplifies integration into electronic systems.

Output Bit Code: OFFSET BINARY

Offset binary output bit code provides a clear and standardized representation of the digital output data, enabling easy interpretation.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for dense packing and efficient use of space on the PCB, ideal for designs requiring high component density.

Minimum Analog Input Voltage: 1.75 V

Low minimum analog input voltage ensures precise conversion of low-level signals, expanding the range of signals this ADC can process accurately.

Output Format: PARALLEL, WORD

Parallel output format in word format simplifies interfacing with digital systems, offering ease of data transmission and processing.

Sample and Hold/Track and Hold: TRACK

Track-and-hold functionality ensures accurate sampling and conversion of input signals, maintaining data integrity during the conversion process.

Technical Specifications

Analog-to-Digital Converters ADS2806Y/1K5G4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0977 %

Sample Rate:

32 MHz

Hold Mode:

Track

Maximum Conversion Time:

100 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

1.75 V

Maximum Analog Input Voltage:

3.25 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.394 in (10 mm)

Length:

0.394 in (10 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

TQFP64,.47SQ

Package Code:

Standards and Codes

JESD-30 Code:

S-PQFP-G64

Qualified:

No

Trade Compliance

ADS2806Y/1K5G4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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