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ADC16DX370RMET

Texas Instruments

ADC16DX370RMET by Texas Instruments

Texas Instruments ADC16DX370RMET is a 16-bit ADC with 2 analog in channels, 370 MHz sample rate, and serial output format. Ideal for industrial applications, it operates b/w -40 to 85°C with a max analog input voltage of ±1.7V. The chip carrier package has a very thin profile and quad terminal position.

Median Price

$449.270

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$287.260

100+ parts

$281.540

1k+ parts

$275.800

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2

$287.260

$281.540

$275.800

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DigiKey

USA . 730 parts In-Stock

1+ parts

$611.280

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-

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$485.973

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730

$611.280

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$485.973

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$323.150

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150

$323.150

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Digiode

USA . 2,561 parts In-Stock

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$329.906

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2,561

$329.906

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Vyrian

USA . 8,159 parts In-Stock

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VNN

France . 4,478 parts In-Stock

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Zilex Electronics Inc.

Canada . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 573 parts In-Stock

1+ parts

$11.477

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-

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573

$11.477

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Parana Technologies

USA . 332 parts In-Stock

1+ parts

$19.754

100+ parts

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$19.725

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332

$19.754

-

$19.725

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Corohmni

South Africa . 703 parts In-Stock

1+ parts

$21.733

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703

$21.733

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DigiPath Technology Company

USA . 146 parts In-Stock

1+ parts

$21.752

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$20.012

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146

$21.752

$20.012

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ChromeModa Solutions

Germany . 1,013 parts In-Stock

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$22.196

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$18.201

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$22.196

$18.201

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IDEA Electronic Components Group

UK . 32 parts In-Stock

1+ parts

$22.196

100+ parts

$21.086

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$19.976

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32

$22.196

$21.086

$19.976

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Ampacity Inc.

Singapore . 770 parts In-Stock

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$295.180

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770

$295.180

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Semicontronic

India . 472 parts In-Stock

1+ parts

$295.180

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$287.800

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$286.325

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$295.180

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$286.325

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Corphita

USA . 381 parts In-Stock

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$312.543

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Aranea Global

USA . 50 parts In-Stock

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$316.687

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$304.020

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$316.687

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$304.020

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Continental Prestige Electronics

USA . 4,138 parts In-Stock

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$323.150

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$316.687

4,138

$323.150

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$316.687

iodParts Technologies Inc.

India . 8,016 parts In-Stock

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Lixinc

USA . 5,537 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Argo Parts USA

USA . 2,257 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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500

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Overview

Unleash the power of precision with the ADC16DX370RMET by Texas Instruments. Designed by a trusted manufacturer, this Analog-to-Digital Converter offers unparalleled quality and reliability. With applications in various industries, this product provides customers with high-speed sampling and accurate conversion rates. Say goodbye to compromise and hello to efficiency with the ADC16DX370RMET, delivering exceptional value and performance that will elevate your projects to new heights. Upgrade to the best and experience the difference today.

Feature Benefit Bullets

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple input sources.

Surface Mount: YES

Surface mount technology makes for easy and convenient installation on a PCB.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the PCB.

No. of Bits: 16

16-bit resolution provides high accuracy in converting analog signals to digital.

No. of Terminals: 56

Having 56 terminals allows for proper connectivity and integration with other components.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of temperature environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and durability to the terminals.

Terminal Position: QUAD

Quad terminal position ensures proper alignment and connection within the circuit.

Maximum Conversion Time: 0.0027 us

Fast conversion time allows for quick and efficient analog-to-digital signal conversion.

Maximum Seated Height: 0.8 mm

Low seated height helps in compact and slim designs for the product.

Width: 8 mm

Compact width allows for easy integration in tight spaces on the PCB.

Peak Reflow Temperature: 260 C

High peak reflow temperature ensures proper soldering and reliability during manufacturing process.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in industrial settings.

Maximum Analog Input Voltage: 1.7 V

High maximum analog input voltage range allows for versatile input signal compatibility.

Sample Rate: 370 MHz

High sample rate enables fast and accurate conversion of analog signals.

Nominal Supply Voltage: 1.2 V

Low nominal supply voltage helps in power efficiency and compatibility with low-voltage systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Multiple output bit code options ensure compatibility with different systems and applications.

Output Format: SERIAL

Serial output format allows for easy data transmission and interfacing with other digital components.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for standard storage and handling conditions.

Technical Specifications

Analog-to-Digital Converters ADC16DX370RMET attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

16

Output Bit Code:

Offset Binary, 2's Complement Binary

Output Format:

Serial

Sample Rate:

370 MHz

Maximum Conversion Time:

2.7 ns

Electrical Specifications

Minimum Analog Input Voltage:

-1.7 V

Maximum Analog Input Voltage:

1.7 V

Nominal Supply Voltage:

1.2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-XQCC-N56

JESD-609 Code:

e3

Trade Compliance

ADC16DX370RMET Converters trade compliance attributes, and parameters.

ECCN

3A001.A.5.A.5

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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