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8W244AMDGGREPG4

Texas Instruments

8W244AMDGGREPG4 by Texas Instruments

8W244AMDGGREPG4 by Texas Instruments is a 48-terminal bus driver with 4 functions, operating at a supply voltage of 3.3V. It offers a propagation delay of 4.4ns and features a small outline package for applications requiring true output polarity and enable low control type.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,618 parts In-Stock

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Digiode

USA . 2,534 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 385 parts In-Stock

1+ parts

$8.090

100+ parts

-

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$7.767

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$7.767

385

$8.090

-

$7.767

$7.767

AZTECH Wire

Italy . 339 parts In-Stock

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$19.411

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339

$19.411

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Parana Technologies

USA . 184 parts In-Stock

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$19.899

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$19.852

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$19.899

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DigiPath Technology Company

USA . 1,898 parts In-Stock

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$21.911

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$20.158

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$20.158

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ChromeModa Solutions

Germany . 6,116 parts In-Stock

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$22.358

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$18.334

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$22.358

$18.334

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IDEA Electronic Components Group

UK . 1,791 parts In-Stock

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$22.358

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$21.240

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$20.122

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1,791

$22.358

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$20.122

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One Stop Electronics

USA . 1,586 parts In-Stock

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$54.000

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Corphita

USA . 4,906 parts In-Stock

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Northwest PG Solutions

USA . 2,156 parts In-Stock

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Kepictronics

USA . 2,150 parts In-Stock

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Microchip USA

USA . 1,047 parts In-Stock

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Native Components

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Overview

Upgrade your electronic devices with the premium quality 8W244AMDGGREPG4 by Texas Instruments. Manufactured by a trusted industry leader, this bus driver and transceiver ensures top-notch performance and reliability. Perfect for a wide range of applications, this product offers exceptional value with its fast propagation delay, low power consumption, and versatile functions. Experience seamless connectivity and enhanced functionality with the cutting-edge technology packed into this compact and efficient component. Choose Texas Instruments for superior quality and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures long-lasting performance and easy handling.

Propagation Delay At Nominal Supply: 4.4 ns

Low propagation delay helps in fast signal transmission, making the product efficient.

Surface Mount: YES

Allows for easy installation and space-saving on PCBs.

No. of Functions: 4

Multiple functions in one component provide versatility and cost-effectiveness.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage, compatible with most systems.

Load Capacitance (CL): 50 pF

Suitable for driving various loads without performance degradation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for challenging environments.

Technology: BICMOS

Utilizes BiCMOS technology for efficient performance and power consumption.

Technical Specifications

Bus Driver & Transceivers 8W244AMDGGREPG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.4 ns

Propagation Delay (tpd):

4.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

8W244AMDGGREPG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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