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8V182512IDGGREP

Texas Instruments

8V182512IDGGREP by Texas Instruments

The Texas Instruments 8V182512IDGGREP is a Bus Driver & Transceiver with 18 bits and 64 terminals. It has a propagation delay of 5.7 ns at 3.3 V, making it ideal for industrial applications requiring fast signal transmission in compact spaces. With a max operating temperature of 85°C and independent control, this device offers reliable performance in harsh environments.

Median Price

$13.418

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,950 parts In-Stock

1+ parts

$13.418

100+ parts

$11.720

1k+ parts

$8.083

10k+ parts

-

5,950

$13.418

$11.720

$8.083

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,621 parts In-Stock

1+ parts

$12.747

100+ parts

-

1k+ parts

-

10k+ parts

-

1,621

$12.747

-

-

-

Vyrian

USA . 8,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,143

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 268 parts In-Stock

1+ parts

$7.782

100+ parts

-

1k+ parts

$7.470

10k+ parts

$7.470

268

$7.782

-

$7.470

$7.470

Native Components

USA . 713 parts In-Stock

1+ parts

$8.116

100+ parts

-

1k+ parts

-

10k+ parts

-

713

$8.116

-

-

-

Northwest PG Solutions

USA . 1,108 parts In-Stock

1+ parts

$8.928

100+ parts

$8.035

1k+ parts

-

10k+ parts

-

1,108

$8.928

$8.035

-

-

Parana Technologies

USA . 694 parts In-Stock

1+ parts

$11.721

100+ parts

-

1k+ parts

$12.115

10k+ parts

-

694

$11.721

-

$12.115

-

Corphita

USA . 4,604 parts In-Stock

1+ parts

$12.076

100+ parts

-

1k+ parts

-

10k+ parts

-

4,604

$12.076

-

-

-

DigiPath Technology Company

USA . 266 parts In-Stock

1+ parts

$12.907

100+ parts

$11.874

1k+ parts

-

10k+ parts

-

266

$12.907

$11.874

-

-

ChromeModa Solutions

Germany . 5,761 parts In-Stock

1+ parts

$13.170

100+ parts

$10.799

1k+ parts

-

10k+ parts

-

5,761

$13.170

$10.799

-

-

IDEA Electronic Components Group

UK . 1,131 parts In-Stock

1+ parts

$13.170

100+ parts

$12.512

1k+ parts

$11.853

10k+ parts

-

1,131

$13.170

$12.512

$11.853

-

AZTECH Wire

Italy . 372 parts In-Stock

1+ parts

$18.100

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$18.100

-

-

-

Microchip USA

USA . 3,295 parts In-Stock

1+ parts

$30.100

100+ parts

$29.670

1k+ parts

$29.460

10k+ parts

$29.240

3,295

$30.100

$29.670

$29.460

$29.240

Component Stockers USA

USA . 4,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,683

-

-

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Perfect Parts

USA . 2,681 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,681

-

-

-

-

Overview

Enhance your electronic designs with the 8V182512IDGGREP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Bus Driver & Transceivers that guarantee reliability and performance. Ideal for a wide range of applications, this product offers customers unmatched value with its high-quality construction and efficient functionality. Upgrade your projects with the 8V182512IDGGREP and experience the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and reliability for the product, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 5.7 ns

Low propagation delay ensures fast and efficient signal processing, enhancing overall performance.

Surface Mount: YES

Offers easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

Ideal voltage range for stable operation and compatibility with other components in the system.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial applications where heat dissipation is a concern.

Technology: BICMOS

Utilizes BiCMOS technology for improved performance in terms of speed, power consumption, and integration capabilities.

Technical Specifications

Bus Driver & Transceivers 8V182512IDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay At Nominal Supply:

5.7 ns

Propagation Delay (tpd):

7.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

8V182512IDGGREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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