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74LVTH18502APMRG4

Texas Instruments

74LVTH18502APMRG4 by Texas Instruments

74LVTH18502APMRG4 by Texas Instruments is a bus driver & transceiver with 9 bits and 2 functions. It operates at a nominal voltage of 3.3V, has a propagation delay of 4.9 ns, and features a max I (ol) of 32 Amp. Ideal for industrial applications requiring bidirectional control with independent control capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,679 parts In-Stock

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3,679

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Digiode

USA . 995 parts In-Stock

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995

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Distributors (Availability)

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Andel Nordic

Denmark . 2,378 parts In-Stock

1+ parts

$1.603

100+ parts

-

1k+ parts

$1.539

10k+ parts

$1.539

2,378

$1.603

-

$1.539

$1.539

AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$6.715

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852

$6.715

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Parana Technologies

USA . 409 parts In-Stock

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$9.501

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$882.289

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$8.551

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409

$9.501

$882.289

$8.551

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DigiPath Technology Company

USA . 1,464 parts In-Stock

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$10.462

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1,464

$10.462

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ChromeModa Solutions

Germany . 5,028 parts In-Stock

1+ parts

$10.675

100+ parts

$8.754

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5,028

$10.675

$8.754

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

1+ parts

$10.675

100+ parts

$10.141

1k+ parts

$9.608

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1,533

$10.675

$10.141

$9.608

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One Stop Electronics

USA . 1,285 parts In-Stock

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$26.000

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1,285

$26.000

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Northwest PG Solutions

USA . 1,880 parts In-Stock

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1,880

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Microchip USA

USA . 1,154 parts In-Stock

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1,154

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Corphita

USA . 749 parts In-Stock

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749

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Native Components

USA . 375 parts In-Stock

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375

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Overview

Elevate your electronic designs with the 74LVTH18502APMRG4 from Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This bus driver and transceiver will enhance your circuitry, offering fast propagation delays and precise output characteristics. Ideal for industrial applications, this innovative device ensures reliable performance in any environment. With 9 bits and 3-state output polarity, this versatile component brings value and efficiency to your projects. Upgrade your technology with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 4.9 ns

Low propagation delay ensures fast and efficient data transmission in bus driver applications.

Surface Mount: YES

Enables easy and secure mounting on PCBs, saving space and simplifying the assembly process.

No. of Functions: 2

Provides versatility and capability to handle multiple functions in bus driver and transceiver applications.

Package Shape: SQUARE

Space-efficient design that allows for easy integration into circuit layouts.

No. of Bits: 9

Offers high resolution and precision in data transmission, suitable for various bus communication protocols.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a commonly used supply voltage, ensuring compatibility with standard electronic systems.

Power Supplies (V): 3.3

Consistent power supply for stable operation, reducing the risk of performance issues.

No. of Terminals: 64

Sufficient terminals for connecting to other components and peripherals, allowing for versatile connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact and streamlined package design for easy integration and space-saving in compact electronic designs.

Maximum I (ol): 32 Amp

High output current capability for driving strong signals in bus systems with multiple nodes.

Propagation Delay (tpd): 6.8 ns

Low propagation delay ensures fast response times and efficient data transmission in bus communication.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Output Characteristics: 3-STATE

Enhanced flexibility in controlling the output signal, enabling efficient data transmission in bus systems.

Trigger Type: POSITIVE EDGE

Ensures precise timing and synchronization of data transmission in bus communication applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance even in harsh environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for reliable connections and optimal signal transmission.

Terminal Position: QUAD

Improved signal integrity and reliability with quad-position terminal layout.

No. of Ports: 2

Dual port configuration for versatile connectivity options in bus communication systems.

Maximum Seated Height: 1.6 mm

Low-profile design for space-saving and streamlined circuit layouts.

Width: 10 mm

Compact width for easy integration into tight PCB layouts.

Output Polarity: TRUE

Correct output polarity ensures compatibility with standard bus communication protocols.

Minimum Supply Voltage (Vsup): 2.7 V

Wide input voltage range for flexibility in power supply options.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance for reliable soldering and assembly processes.

Length: 10 mm

Compact length for easy integration into space-constrained electronic designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable performance in demanding environments.

Technology: BICMOS

Utilizes advanced BiCMOS technology for efficient signal processing and low power consumption.

Terminal Form: GULL WING

Gull-wing terminal form for easy soldering and reliable connections.

Packing Method: TR

Tape and reel packaging method for convenient handling and automated assembly processes.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts and compact designs.

Count Direction: BIDIRECTIONAL

Bidirectional data transmission capability for versatile communication in bus systems.

Control Type: INDEPENDENT CONTROL

Independent control for each function, allowing for customized operation in bus driver applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating for moisture resistance, ensuring reliability in humid environments.

Maximum Supply Voltage (Vsup): 3.6 V

Higher maximum supply voltage for flexibility in power supply options and compatibility.

Maximum Power Supply Current (ICC): 24 mA

Low power consumption for efficient operation and reduced energy consumption.

Technical Specifications

Bus Driver & Transceivers 74LVTH18502APMRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

SUPPORTS IEEE STANDARD 1149.1-1990 BOUNDARY SCAN

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

24 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

6.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

10 mm

Trade Compliance

74LVTH18502APMRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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