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74LVC1G3157DCKRE4

Texas Instruments

74LVC1G3157DCKRE4 by Texas Instruments

74LVC1G3157DCKRE4 by Texas Instruments is a SPDT switch with 30 ohm Ron, 340 kHz bandwidth, and 57 dB isolation. It operates at -40 to 85 °C and has a supply voltage range of 1.65V to 5.5V. Ideal for industrial applications requiring fast switching with low on-state resistance and high isolation levels.

Median Price

$0.076

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.076

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-

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150

$0.076

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Vyrian

USA . 6,960 parts In-Stock

1+ parts

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6,960

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Digiode

USA . 1,037 parts In-Stock

1+ parts

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1,037

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VNN

France . 30 parts In-Stock

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30

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,578 parts In-Stock

1+ parts

$0.076

100+ parts

-

1k+ parts

-

10k+ parts

$0.074

2,578

$0.076

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-

$0.074

Continental Prestige Electronics

USA . 2,116 parts In-Stock

1+ parts

$0.076

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-

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$0.074

2,116

$0.076

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$0.074

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.076

100+ parts

$0.074

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-

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1,000

$0.076

$0.074

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Ampacity Inc.

Singapore . 203 parts In-Stock

1+ parts

$0.500

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203

$0.500

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One Stop Electronics

USA . 902 parts In-Stock

1+ parts

$2.500

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-

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902

$2.500

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Corohmni

South Africa . 1,161 parts In-Stock

1+ parts

$4.646

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$4.646

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Semicontronic

India . 407 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

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$6.305

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407

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 408 parts In-Stock

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$16.902

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408

$16.902

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Parana Technologies

USA . 1,922 parts In-Stock

1+ parts

$20.433

100+ parts

$1,897.479

1k+ parts

$18.389

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1,922

$20.433

$1,897.479

$18.389

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DigiPath Technology Company

USA . 985 parts In-Stock

1+ parts

$22.499

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985

$22.499

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ChromeModa Solutions

Germany . 4,894 parts In-Stock

1+ parts

$22.958

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$18.826

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4,894

$22.958

$18.826

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IDEA Electronic Components Group

UK . 263 parts In-Stock

1+ parts

$22.958

100+ parts

$21.810

1k+ parts

$20.662

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263

$22.958

$21.810

$20.662

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iodParts Technologies Inc.

India . 17,080 parts In-Stock

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17,080

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Infinite Electronics LLP (Excess)

. 3,008 parts In-Stock

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Microchip USA

USA . 2,918 parts In-Stock

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Corphita

USA . 2,733 parts In-Stock

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2,733

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

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100+ parts

$0.203

1k+ parts

$0.203

10k+ parts

$0.203

100

-

$0.203

$0.203

$0.203

Overview

Experience seamless signal routing with the 74LVC1G3157DCKRE4 multiplexer from Texas Instruments. Designed with precision and reliability in mind, this versatile component is perfect for a wide range of applications, offering customers unparalleled performance and efficiency. Whether you're working on industrial automation, consumer electronics, or telecommunications projects, this switch delivers exceptional value, benefits, and advantages that will take your designs to the next level. Trust Texas Instruments to provide top-quality solutions for all your multiplexing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation onto PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 2.3 V

Operates efficiently at a lower nominal supply voltage, reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications where temperature fluctuations may occur.

Technology: CMOS

CMOS technology provides low power consumption and fast switching speeds, enhancing the overall efficiency of the product.

Technical Specifications

Multiplexers & Switches 74LVC1G3157DCKRE4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

340 kHz

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NC

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

57 dB

Nominal On-state Resistance Match:

.1 ohm

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

COMMON OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexers or Switches

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

7.5 ns

Maximum Switch-on Time:

14 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.25 mm

Trade Compliance

74LVC1G3157DCKRE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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