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74FCT16374CTPVCG4

Texas Instruments

74FCT16374CTPVCG4 by Texas Instruments

BUS DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$1.512

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.460

1k+ parts

$1.210

10k+ parts

$1.080

500

-

$1.460

$1.210

$1.080

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.830

10k+ parts

-

500

-

-

$1.830

-

Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.512

10k+ parts

$1.350

500

-

-

$1.512

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,052 parts In-Stock

1+ parts

$1.130

100+ parts

-

1k+ parts

-

10k+ parts

-

4,052

$1.130

-

-

-

Vyrian

USA . 6,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,441

-

-

-

-

DigiKey Marketplace

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

-

10k+ parts

-

500

-

$1.240

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 701 parts In-Stock

1+ parts

$0.457

100+ parts

-

1k+ parts

-

10k+ parts

$0.438

701

$0.457

-

-

$0.438

Northwest PG Solutions

USA . 1,321 parts In-Stock

1+ parts

$0.502

100+ parts

-

1k+ parts

-

10k+ parts

$0.443

1,321

$0.502

-

-

$0.443

Corphita

USA . 273 parts In-Stock

1+ parts

$1.071

100+ parts

-

1k+ parts

-

10k+ parts

-

273

$1.071

-

-

-

Andel Nordic

Denmark . 386 parts In-Stock

1+ parts

$3.241

100+ parts

-

1k+ parts

$3.112

10k+ parts

$3.112

386

$3.241

-

$3.112

$3.112

Parana Technologies

USA . 697 parts In-Stock

1+ parts

$17.578

100+ parts

-

1k+ parts

$17.774

10k+ parts

-

697

$17.578

-

$17.774

-

DigiPath Technology Company

USA . 1,402 parts In-Stock

1+ parts

$19.356

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

$19.356

-

-

-

ChromeModa Solutions

Germany . 3,155 parts In-Stock

1+ parts

$19.751

100+ parts

$16.196

1k+ parts

-

10k+ parts

-

3,155

$19.751

$16.196

-

-

IDEA Electronic Components Group

UK . 668 parts In-Stock

1+ parts

$19.751

100+ parts

$18.763

1k+ parts

$17.776

10k+ parts

-

668

$19.751

$18.763

$17.776

-

Technical Specifications

Bus Driver & Transceivers 74FCT16374CTPVCG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.2 ns

Propagation Delay (tpd):

5.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

74FCT16374CTPVCG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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