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74FCT16245CTPVCTG4

Texas Instruments

74FCT16245CTPVCTG4 by Texas Instruments

74FCT16245CTPVCTG4 by Texas Instruments is a bus driver & transceiver with 8 bits, 2 functions, and a propagation delay of 4.1 ns. It operates at a nominal voltage of 5V and has a max operating temperature of 85°C. Ideal for bidirectional control applications in industrial settings due to its CMOS technology and compact design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,543 parts In-Stock

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Digiode

USA . 4,115 parts In-Stock

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Euro-Tech

UK . 680 parts In-Stock

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680

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Distributors (Availability)

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Andel Nordic

Denmark . 187 parts In-Stock

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$7.773

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$7.462

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$7.462

187

$7.773

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$7.462

$7.462

AZTECH Wire

Italy . 836 parts In-Stock

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$10.923

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836

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Parana Technologies

USA . 2,126 parts In-Stock

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$19.073

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$19.125

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$19.073

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DigiPath Technology Company

USA . 2,254 parts In-Stock

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$21.001

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$19.321

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$21.001

$19.321

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ChromeModa Solutions

Germany . 5,240 parts In-Stock

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$21.430

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$17.573

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$21.430

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IDEA Electronic Components Group

UK . 315 parts In-Stock

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$21.430

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$20.358

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$19.287

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315

$21.430

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$19.287

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One Stop Electronics

USA . 820 parts In-Stock

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$49.000

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820

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Corphita

USA . 4,536 parts In-Stock

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Microchip USA

USA . 2,348 parts In-Stock

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Northwest PG Solutions

USA . 2,317 parts In-Stock

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Native Components

USA . 846 parts In-Stock

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Overview

Unlock seamless communication with the cutting-edge 74FCT16245CTPVCTG4 by Texas Instruments. Crafted with precision and expertise, this bus driver and transceiver offers unparalleled performance and reliability. Ideal for a wide range of applications, this product boasts a compact design and advanced features that guarantee optimal functionality. Elevate your projects with the quality and value that only Texas Instruments can deliver. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for transportation applications.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures efficient and fast data transmission within the bus system.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on circuit boards.

No. of Functions: 2

Having multiple functions in a single device simplifies the circuit design and reduces complexity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74FCT16245CTPVCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

4.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.49 mm

Trade Compliance

74FCT16245CTPVCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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