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74AVCBH164245GRG4

Texas Instruments

74AVCBH164245GRG4 by Texas Instruments

74AVCBH164245GRG4 by Texas Instruments is a Bus Driver & Transceiver with 8-bit capacity, operating at 1.5/3.3V supply voltage. It features a propagation delay of 6.8 ns and supports TRUE output polarity, making it ideal for industrial applications requiring bidirectional control in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,006 parts In-Stock

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6,006

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Digiode

USA . 2,404 parts In-Stock

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2,404

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Distributors (Availability)

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Andel Nordic

Denmark . 283 parts In-Stock

1+ parts

$5.357

100+ parts

-

1k+ parts

$5.143

10k+ parts

$5.143

283

$5.357

-

$5.143

$5.143

AZTECH Wire

Italy . 252 parts In-Stock

1+ parts

$15.066

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252

$15.066

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Parana Technologies

USA . 2,302 parts In-Stock

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$26.277

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$26.870

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$26.277

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$26.870

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DigiPath Technology Company

USA . 1,067 parts In-Stock

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$28.934

100+ parts

$26.620

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1,067

$28.934

$26.620

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ChromeModa Solutions

Germany . 2,029 parts In-Stock

1+ parts

$29.525

100+ parts

$24.210

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2,029

$29.525

$24.210

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IDEA Electronic Components Group

UK . 134 parts In-Stock

1+ parts

$29.525

100+ parts

$28.049

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$26.572

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134

$29.525

$28.049

$26.572

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One Stop Electronics

USA . 380 parts In-Stock

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$34.000

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380

$34.000

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Component Stockers USA

USA . 342 parts In-Stock

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$99.990

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342

$99.990

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Corphita

USA . 2,421 parts In-Stock

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Microchip USA

USA . 2,141 parts In-Stock

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Native Components

USA . 675 parts In-Stock

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675

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Northwest PG Solutions

USA . 584 parts In-Stock

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584

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Overview

Enhance your electronic designs with the 74AVCBH164245GRG4 by Texas Instruments, a top-quality bus driver & transceiver that delivers unmatched performance and reliability. Manufactured by the reputable Texas Instruments, this product offers seamless translation between different voltage levels, making it ideal for a wide range of applications. With its compact design and advanced features, the 74AVCBH164245GRG4 provides exceptional value to customers seeking high-speed data transmission and efficient power management. Upgrade your projects today with this cutting-edge solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resilience to the package, making it suitable for rugged environments often found in bus driver applications.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures faster transmission of signals, improving overall performance and efficiency of the bus driver.

No. of Functions: 2

Having multiple functions in a single device reduces the need for additional components, saving space and cost in bus driver designs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient PCB layout and space utilization, making it easier to integrate this bus driver into existing designs.

No. of Bits: 8

Supporting 8 bits allows for data transmission with higher resolution and accuracy, crucial in bus driver applications where precise communication is required.

Technical Specifications

Bus Driver & Transceivers 74AVCBH164245GRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

7.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

1.5/3.3V&1.5/3.3V

Width:

6.1 mm

Trade Compliance

74AVCBH164245GRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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