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74AVC4T774RGYRG4

Texas Instruments

74AVC4T774RGYRG4 by Texas Instruments

74AVC4T774RGYRG4 by Texas Instruments is a 4-bit bus driver with 2.4 ns propagation delay, operating at 1.5/3.3V translation for industrial applications. It features a package style of CHIP CARRIER and has a max operating temperature of 85°C, making it suitable for bidirectional control in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,506 parts In-Stock

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Digiode

USA . 3,002 parts In-Stock

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3,002

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Distributors (Availability)

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Andel Nordic

Denmark . 264 parts In-Stock

1+ parts

$5.616

100+ parts

-

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$5.392

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$5.392

264

$5.616

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$5.392

$5.392

Parana Technologies

USA . 1,596 parts In-Stock

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$13.194

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$13.700

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$13.700

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AZTECH Wire

Italy . 871 parts In-Stock

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$13.642

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DigiPath Technology Company

USA . 1,403 parts In-Stock

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$14.528

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$14.528

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ChromeModa Solutions

Germany . 1,318 parts In-Stock

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$14.825

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$12.156

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$14.825

$12.156

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IDEA Electronic Components Group

UK . 1,157 parts In-Stock

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$14.825

100+ parts

$14.084

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$13.342

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$14.825

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One Stop Electronics

USA . 651 parts In-Stock

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$28.000

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651

$28.000

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Microchip USA

USA . 2,340 parts In-Stock

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Northwest PG Solutions

USA . 1,862 parts In-Stock

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Corphita

USA . 1,540 parts In-Stock

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Native Components

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Overview

Discover the cutting-edge technology of the 74AVC4T774RGYRG4 by Texas Instruments, a top-tier manufacturer renowned for its high-quality products. As a bus driver and transceiver, this component offers seamless communication in various applications. With fast propagation delay and versatile voltage translation capabilities, this chip ensures efficient data transfer. Its compact design and advanced features make it ideal for industrial settings. Trust Texas Instruments to deliver reliability and innovation, providing unmatched value and performance to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for portable and rugged applications.

Propagation Delay At Nominal Supply: 2.4 ns

The low propagation delay ensures fast data transmission, making the product efficient for high-speed bus communication.

Surface Mount: YES

Being surface mountable, the product can be easily integrated onto circuit boards, allowing for space-saving and streamlined assembly processes.

No. of Bits: 4

With 4 bits, the product can handle a reasonable amount of data processing, suitable for various bus communication protocols.

Nominal Supply Voltage / Vsup (V): 1.5

The low nominal supply voltage of 1.5V results in lower power consumption, making the product energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product can withstand harsh environmental conditions, increasing its reliability and longevity.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it suitable for battery-operated devices and noise-sensitive applications.

Technical Specifications

Bus Driver & Transceivers 74AVC4T774RGYRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

TWO SEPARATE CONFIGURABLE POWER-SUPPLY FOR PORT A AND PORT B

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16/20,.14X.16,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.016 mA

Propagation Delay At Nominal Supply:

2.4 ns

Propagation Delay (tpd):

5.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

1.5/3.3V&1.5/3.3V

Width:

3.5 mm

Trade Compliance

74AVC4T774RGYRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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