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74AVC16T245DGGRE4

Texas Instruments

74AVC16T245DGGRE4 by Texas Instruments

74AVC16T245DGGRE4 by Texas Instruments is a bus driver & transceiver with 8 bits, operating at 1.5/3.3V. It features a propagation delay of 6.2 ns and supports common control with dual terminal position for bidirectional communication. Ideal for industrial applications requiring fast signal translation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,968 parts In-Stock

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Vyrian

USA . 2,851 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 893 parts In-Stock

1+ parts

$0.053

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$0.051

893

$0.053

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$0.051

Andel Nordic

Denmark . 196 parts In-Stock

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$2.188

100+ parts

-

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$2.101

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$2.101

196

$2.188

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$2.101

$2.101

AZTECH Wire

Italy . 388 parts In-Stock

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$5.200

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388

$5.200

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One Stop Electronics

USA . 780 parts In-Stock

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$14.000

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780

$14.000

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Parana Technologies

USA . 1,572 parts In-Stock

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$27.180

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$33.016

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1,572

$27.180

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$33.016

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DigiPath Technology Company

USA . 692 parts In-Stock

1+ parts

$29.928

100+ parts

$27.534

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692

$29.928

$27.534

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ChromeModa Solutions

Germany . 3,798 parts In-Stock

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$30.539

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$25.042

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$25.042

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IDEA Electronic Components Group

UK . 1,321 parts In-Stock

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$30.539

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$29.012

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$27.485

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$27.485

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Microchip USA

USA . 4,387 parts In-Stock

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Northwest PG Solutions

USA . 1,229 parts In-Stock

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Corphita

USA . 986 parts In-Stock

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Perfect Parts

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Overview

Unlock seamless data transmission with the 74AVC16T245DGGRE4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile product ensures smooth signal translation and robust connectivity. Experience the value of superior quality and efficiency with Texas Instruments' cutting-edge technology, setting new standards in the industry. Elevate your projects with the exceptional benefits and advantages of the 74AVC16T245DGGRE4, a game-changer in data communication solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Propagation Delay At Nominal Supply: 6.2 ns

Low propagation delay ensures fast data transmission, making the product efficient and reliable.

No. of Functions: 2

Having multiple functions allows for versatile use of the product in different applications.

Surface Mount: YES

Surface mount technology makes the product easy to install and minimizes space usage on the circuit board.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission, making the product suitable for various communication requirements.

Nominal Supply Voltage / Vsup (V): 1.5

Stable supply voltage ensures consistent performance of the product in different conditions.

Power Supplies (V): 1.5/3.3

The availability of multiple power supply options offers flexibility in powering the product based on the application's requirements.

Output Characteristics: 3-STATE

3-state output allows the product to control multiple buses, enabling efficient data transmission in complex systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74AVC16T245DGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Maximum Power Supply Current (ICC):

.045 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

1.5/3.3V&1.5/3.3V

Width:

6.1 mm

Trade Compliance

74AVC16T245DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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