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74AVC16245DGVRG4

Texas Instruments

74AVC16245DGVRG4 by Texas Instruments

74AVC16245DGVRG4 by Texas Instruments is a bus driver & transceiver with 8 bits and 2 functions. It has a propagation delay of 1.7 ns at nominal supply, operates at a voltage of 3.3V, and features a small outline package style. Ideal for industrial applications requiring bidirectional control with common control type.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,175 parts In-Stock

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Digiode

USA . 2,579 parts In-Stock

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VNN

France . 1,113 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Andel Nordic

Denmark . 38 parts In-Stock

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$6.443

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$6.185

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$6.185

38

$6.443

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$6.185

Parana Technologies

USA . 828 parts In-Stock

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$17.959

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$18.125

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828

$17.959

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AZTECH Wire

Italy . 834 parts In-Stock

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$18.201

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DigiPath Technology Company

USA . 2,240 parts In-Stock

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$19.775

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$19.775

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IDEA Electronic Components Group

UK . 1,714 parts In-Stock

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$20.179

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$19.170

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$18.161

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ChromeModa Solutions

Germany . 1,304 parts In-Stock

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$20.179

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$16.547

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Ampacity Inc.

Singapore . 309 parts In-Stock

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$32.000

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One Stop Electronics

USA . 533 parts In-Stock

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$44.000

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QUARKTWIN TECHNOLOGY LTD

USA . 20,647 parts In-Stock

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Microchip USA

USA . 4,134 parts In-Stock

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Continental Prestige Electronics

USA . 3,825 parts In-Stock

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Corphita

USA . 3,453 parts In-Stock

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Argo Parts USA

USA . 1,837 parts In-Stock

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Bastille Electronics

Australia . 68 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments 74AVC16245DGVRG4 Bus Driver & Transceivers. Known for their exceptional quality and reliability, Texas Instruments products are trusted by professionals worldwide. This versatile component offers fast propagation delay, low power consumption, and a compact design, making it ideal for a wide range of applications. Whether you're working on industrial automation, telecommunications, or consumer electronics, this bus driver will enhance the performance of your circuitry. Upgrade your projects with Texas Instruments and experience superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for use in transportation vehicles like buses.

Propagation Delay At Nominal Supply: 1.7 ns

Low propagation delay ensures quick and efficient data transmission, making this product ideal for high-speed communication in bus systems.

Surface Mount: YES

Being surface mountable simplifies the installation process, allowing for easy and compact integration into bus driver and transceiver systems.

No. of Functions: 2

Having multiple functions in one component helps in reducing the overall system complexity and footprint, making it a cost-effective choice for bus communication applications.

Nominal Supply Voltage / Vsup (V): 1.5

Designed to operate at a low supply voltage of 1.5V, this product offers energy efficiency and compatibility with low-power bus systems.

Output Characteristics: 3-STATE

The 3-STATE output allows for tri-state bus control, enabling efficient bus sharing and communication protocols in multi-device bus systems.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this product reliable and suitable for bus driver applications.

Technical Specifications

Bus Driver & Transceivers 74AVC16245DGVRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

1.7 ns

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage / Vsup (V):

1.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

74AVC16245DGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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