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74ALVCH16373DLRG4

Texas Instruments

74ALVCH16373DLRG4 by Texas Instruments

74ALVCH16373DLRG4 by Texas Instruments is a bus driver with 8 bits and 3.6 ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 1.8 V to 3.6 V, with a max temperature of 85°C. This CMOS technology transceiver has dual terminals and supports surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,773 parts In-Stock

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Digiode

USA . 1,922 parts In-Stock

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Andel Nordic

Denmark . 285 parts In-Stock

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$4.286

100+ parts

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$4.115

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$4.115

285

$4.286

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$4.115

$4.115

Parana Technologies

USA . 260 parts In-Stock

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$11.329

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$11.758

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260

$11.329

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$11.758

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DigiPath Technology Company

USA . 1,081 parts In-Stock

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$12.474

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$11.476

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$11.476

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ChromeModa Solutions

Germany . 4,469 parts In-Stock

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$12.729

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$10.438

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$12.729

$10.438

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IDEA Electronic Components Group

UK . 433 parts In-Stock

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$12.729

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$12.093

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$11.456

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433

$12.729

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$11.456

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Native Components

USA . 929 parts In-Stock

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$13.037

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929

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Northwest PG Solutions

USA . 1,169 parts In-Stock

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$14.340

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$12.906

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AZTECH Wire

Italy . 345 parts In-Stock

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$15.722

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One Stop Electronics

USA . 1,208 parts In-Stock

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$48.000

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Component Stockers USA

USA . 737 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 19,260 parts In-Stock

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Microchip USA

USA . 4,232 parts In-Stock

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Corphita

USA . 2,660 parts In-Stock

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Overview

Elevate your electronic designs with the Texas Instruments 74ALVCH16373DLRG4 Bus Driver & Transceivers. Manufactured with precision and expertise, this product offers reliable performance and versatility for a wide range of applications. With fast propagation delay, low power consumption, and high output drive capability, this component ensures efficient signal transmission while maximizing energy efficiency. Trust Texas Instruments to deliver top-notch quality and innovation in every product, providing you with a competitive edge in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 3.6 ns

Fast propagation delay ensures quick signal transmission and responsiveness in bus communication systems.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low voltage, making it energy-efficient and suitable for applications with power constraints.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance state, which reduces interference and improves signal integrity in bus communication.

Maximum Operating Temperature: 85 °C

Can withstand high operational temperatures, making it suitable for industrial environments with varying temperature conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and compatibility with various digital logic circuits.

Technical Specifications

Bus Driver & Transceivers 74ALVCH16373DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

15.875 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.6 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.49 mm

Trade Compliance

74ALVCH16373DLRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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