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74ACT16841DLR

Texas Instruments

74ACT16841DLR by Texas Instruments

74ACT16841DLR by Texas Instruments is a Bus Driver & Transceiver with 10 bits, 2 functions, and a propagation delay of 12.2 ns at 5V. It features a small outline package style for industrial applications requiring true output polarity and dual terminal position.

Median Price

$4.730

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.100

1k+ parts

$3.670

10k+ parts

$3.460

1,000

-

$4.100

$3.670

$3.460

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$4.730

1k+ parts

-

10k+ parts

-

1,000

-

$4.730

-

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$5.125

1k+ parts

$4.588

10k+ parts

$4.325

1,000

-

$5.125

$4.588

$4.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,426 parts In-Stock

1+ parts

$4.322

100+ parts

-

1k+ parts

-

10k+ parts

-

4,426

$4.322

-

-

-

Bristol Electronics

USA . 376 parts In-Stock

1+ parts

$7.392

100+ parts

$3.203

1k+ parts

$3.031

10k+ parts

-

376

$7.392

$3.203

$3.031

-

Vyrian

USA . 3,281 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,281

-

-

-

-

DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

R&J Components

USA . 560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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560

-

-

-

-

Dan-Mar Components

USA . 376 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

376

-

-

-

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ACDS - Activité Composants Distribution Service

France . 290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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290

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 83 parts In-Stock

1+ parts

$0.675

100+ parts

-

1k+ parts

-

10k+ parts

-

83

$0.675

-

-

-

Northwest PG Solutions

USA . 584 parts In-Stock

1+ parts

$0.742

100+ parts

-

1k+ parts

-

10k+ parts

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584

$0.742

-

-

-

Corphita

USA . 4,530 parts In-Stock

1+ parts

$4.095

100+ parts

-

1k+ parts

-

10k+ parts

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4,530

$4.095

-

-

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Component Stockers USA

USA . 1,362 parts In-Stock

1+ parts

$4.610

100+ parts

$4.330

1k+ parts

$3.910

10k+ parts

-

1,362

$4.610

$4.330

$3.910

-

Parana Technologies

USA . 11 parts In-Stock

1+ parts

$12.238

100+ parts

-

1k+ parts

$12.661

10k+ parts

-

11

$12.238

-

$12.661

-

DigiPath Technology Company

USA . 1,433 parts In-Stock

1+ parts

$13.475

100+ parts

$12.397

1k+ parts

-

10k+ parts

-

1,433

$13.475

$12.397

-

-

IDEA Electronic Components Group

UK . 1,683 parts In-Stock

1+ parts

$13.750

100+ parts

$13.062

1k+ parts

$12.375

10k+ parts

-

1,683

$13.750

$13.062

$12.375

-

ChromeModa Solutions

Germany . 1,112 parts In-Stock

1+ parts

$13.750

100+ parts

$11.275

1k+ parts

-

10k+ parts

-

1,112

$13.750

$11.275

-

-

A-Z Elektronik GmbH

Germany . 6,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,557

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Microchip USA

USA . 312 parts In-Stock

1+ parts

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312

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Overview

Looking for a high-quality, reliable Bus Driver & Transceiver for your project? Look no further than the 74ACT16841DLR by Texas Instruments! With its advanced technology and industrial-grade components, this product offers unmatched performance and durability. Whether you're working on industrial automation, telecommunications, or automotive electronics, this versatile device is sure to meet your needs. Trust Texas Instruments to deliver products that exceed expectations and bring value to your designs. Choose the 74ACT16841DLR for superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 12.2 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

No. of Functions: 2

Having multiple functions in one device increases functionality and integration, reducing the need for additional components.

Package Shape: RECTANGULAR

Rectangular package shape maximizes space efficiency on the PCB, allowing for compact designs in constrained environments.

No. of Bits: 10

With 10 bits, this product can handle a wide range of data inputs, making it versatile and suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes integration with existing systems easier and more convenient.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable operation and signal integrity in different circuit configurations.

Power Supplies (V): 5

Consistent power supply voltage of 5V ensures reliable performance and compatibility with standard power sources.

No. of Terminals: 56

Having 56 terminals provides ample connectivity options for interfacing with other components, enhancing flexibility in system design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the PCB, enabling compact and efficient circuit layouts.

Maximum I (ol): 24 Amp

High output current capability allows for driving power-hungry loads, making this product suitable for demanding applications.

Propagation Delay (tpd): 12.7 ns

Low propagation delay ensures minimal signal distortion and fast response times, critical for high-performance applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range enables reliable operation in harsh environmental conditions, suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output capability allows for tri-state logic control, enhancing compatibility with different interface standards and bus protocols.

Minimum Operating Temperature: -40 °C

Operating at low temperatures ensures reliable performance in cold environments, making this product suitable for outdoor or automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability in various operating conditions.

Terminal Position: DUAL

Dual terminal position offers increased flexibility in PCB mounting and interconnection, facilitating versatile system integration.

No. of Ports: 2

Having two ports allows for simultaneous communication with multiple devices, enhancing system connectivity and flexibility.

Maximum Seated Height: 2.79 mm

Low seated height minimizes PCB space requirements and profile, making this product suitable for compact and slim designs.

Width: 7.5 mm

Narrow width saves PCB space and allows for densely populated circuit layouts, ideal for applications with space constraints.

Output Polarity: TRUE

True output polarity ensures compatibility with standard logic levels, simplifying interfacing with other digital components.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage allows for operation in battery-powered or low-power systems, extending the product's application range.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow process time ensures reliable and consistent solder joint formation during PCB assembly, reducing the risk of defects.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for lead-free soldering processes, compliant with environmental regulations and industry standards.

Length: 18.415 mm

Compact length saves PCB space and facilitates efficient circuit layout, suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions, making this product suitable for industrial automation and control systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic levels, making this product energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and mechanical stability, ensuring robust performance in vibration-prone environments.

Packing Method: TR

TR packing method protects the product during transportation and storage, ensuring product integrity and reliability until deployment.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting and reliable electrical connections, ideal for applications requiring compact and reliable circuitry.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance provides overvoltage protection and flexibility in power supply options, enhancing product robustness and reliability.

Technical Specifications

Bus Driver & Transceivers 74ACT16841DLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

12.2 ns

Propagation Delay (tpd):

12.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

74ACT16841DLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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