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74ACT16652DLRG4

Texas Instruments

74ACT16652DLRG4 by Texas Instruments

74ACT16652DLRG4 by Texas Instruments is a bus driver & transceiver with 8 bits, 2 functions, and a propagation delay of 12.3 ns. It operates at a nominal voltage of 5V and has a max operating temperature of 85°C. Ideal for bidirectional applications requiring independent control in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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VNN

France . 3,734 parts In-Stock

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Vyrian

USA . 2,849 parts In-Stock

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Digiode

USA . 2,685 parts In-Stock

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2,685

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Nova Conductors

Japan . 50 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 23 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 195 parts In-Stock

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$2.328

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-

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$2.235

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$2.235

195

$2.328

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$2.235

$2.235

AZTECH Wire

Italy . 485 parts In-Stock

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$5.944

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$5.944

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Parana Technologies

USA . 521 parts In-Stock

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$27.060

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$31.767

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521

$27.060

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$31.767

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DigiPath Technology Company

USA . 1,188 parts In-Stock

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$29.797

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One Stop Electronics

USA . 282 parts In-Stock

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$30.000

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282

$30.000

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ChromeModa Solutions

Germany . 4,002 parts In-Stock

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$30.405

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$24.932

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$30.405

$24.932

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IDEA Electronic Components Group

UK . 537 parts In-Stock

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$30.405

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$28.885

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$27.364

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537

$30.405

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$27.364

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Ampacity Inc.

Singapore . 627 parts In-Stock

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$49.000

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A-Z Elektronik GmbH

Germany . 6,618 parts In-Stock

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Microchip USA

USA . 4,238 parts In-Stock

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Corphita

USA . 3,234 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Elevate your electronic designs with the top-tier quality and reliability of Texas Instruments' 74ACT16652DLRG4 Bus Driver & Transceivers. This innovative product offers unmatched performance and precision, making it the perfect choice for a wide range of applications. Experience seamless data transfer, enhanced efficiency, and superior functionality with this cutting-edge solution. Trust in Texas Instruments to deliver excellence in every aspect, ensuring that your projects are always ahead of the curve. Elevate your designs with the 74ACT16652DLRG4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the product, making it reliable for long-term use.

Propagation Delay At Nominal Supply: 11.6 ns

Low propagation delay indicates faster signal transmission, enhancing the efficiency of the bus driver and transceiver.

Surface Mount: YES

Surface mount capability allows for easier and more efficient installation on circuit boards.

No. of Functions: 2

Having multiple functions in a single product increases versatility and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common 5V supply voltage makes it compatible with a wide range of systems.

Output Characteristics: 3-STATE

3-state outputs allow for high impedance state, which is useful for bus systems where multiple drivers may be connected to the same bus.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, ensuring reliability in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74ACT16652DLRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.6 ns

Propagation Delay (tpd):

12.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

74ACT16652DLRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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